CY15B108QI-20LPXCT

Memory IC Overview

The CY15B108QI-20LPXCT is an 8 Mbit Ferroelectric Random Access Memory (F-RAM) device from Infineon Technologies, logically organized as 1024K x 8 bits. It features a Serial Peripheral Interface (SPI) with a maximum clock frequency of 20 MHz. The component operates within an industrial temperature range of -40°C to +85°C and supports a supply voltage between 1.8 V and 3.6 V. It is housed in an 8-GQFN package measuring 3.23x3.28 mm.

Memory IC Feature Summary

• Provides virtually unlimited read/write endurance for high-cycle data logging applications
• Enables non-volatile storage without requiring complex write cycles or delays
• Supports standard SPI communication protocols for straightforward integration

Memory IC Applications

• Industrial data logging systems requiring frequent updates
• Smart metering infrastructure for utility monitoring
• Automotive electronic control units demanding high reliability

Memory IC Procurement Notes

Verify the specific suffix 'T' indicates tape-and-reel packaging configuration when sourcing. Confirm the industrial temperature grade (-40°C to +85°C) matches system requirements. Ensure the 1.8V to 3.6V supply voltage range aligns with the target power design constraints before finalizing procurement.

Memory IC Selection Notes

Select this part for designs prioritizing endurance over density. Compare against the commercial grade CY15V108 variant if operating temperatures remain above 0°C. Verify that the 20 MHz SPI speed meets the system's throughput requirements compared to slower memory alternatives.

Memory IC Part Context

This component belongs to the Excelon LP F-RAM family, designed for robust performance in harsh environments. It utilizes ferroelectric technology to offer superior durability compared to traditional flash memory solutions. The GQFN package facilitates surface-mount assembly in compact electronic devices.

Memory IC Replacement Considerations

The CY15B108QI-20LPXI is a pin-compatible alternative available in tray packaging. Both parts share identical electrical specifications and functional characteristics, differing primarily in shipping format.