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The CY74FCT273ATSOCT is an octal D-type flip-flop with clear, manufactured by Texas Instruments. It operates within a supply voltage range of 4.75 V to 5.25 V and features TTL-compatible inputs with CMOS outputs. The device provides non-inverting logic in a 20-pin SOIC package. Key electrical parameters include a propagation delay of 5.8 ns, a high-level output current of -32 mA, and a low-level output current of 64 mA. It supports surface mount installation and functions reliably across an operating temperature range from -40 °C to +85 °C.
Verify the manufacturer designation carefully, as the component is produced by Texas Instruments despite the Cypress Semiconductor Corp origin of the broader FCT product family lineage. Confirm the specific suffix 'SOCT' corresponds to the required tape-and-reel packaging format rather than tube distribution. Ensure that the procurement source explicitly lists the 20-lead SOIC package variant to avoid confusion with other pinout configurations within the same logical series.
Select this component when an octal register with a master clear function is required for high-speed applications. The 5.8 ns propagation delay suits designs needing rapid data capture without excessive latency. The wide output current capability allows driving moderate capacitive loads directly. Verify that the system power supply remains strictly within the 4.75 V to 5.25 V window to maintain timing specifications and prevent electrical overstress during operation.
This part belongs to the CY74FCT273T series, representing a widely adopted standard for octal registers in mixed-signal environments. The FCT technology bridges the speed advantages of ECL with the noise immunity and power efficiency of CMOS. Texas Instruments continues to support this legacy interface standard, ensuring compatibility with existing board layouts designed around the original Fairchild specifications while offering modern manufacturing reliability.
The CY74FCT273ATQCT serves as a verified substitute, offering identical logical functionality in a 20-SSOP package. Both components share the same core electrical characteristics and pin assignments, allowing for potential form-factor adjustments if space constraints permit switching from SOIC to SSOP geometry.