CY74FCT827CTQCTG4

Overview

The CY74FCT827CTQCTG4 is a high-speed octal buffer and line driver manufactured by Texas Instruments. It operates within a supply voltage range of 4.75 V to 5.25 V and features three-state outputs for effective bus driving applications. The device is housed in a 24-pin SSOP package and supports an operating temperature range from -40°C to +85°C. It belongs to the FCT logic family, designed for fast switching speeds with low power consumption.

Feature Summary

• Provides eight independent buffer channels for signal transmission
• Features three-state outputs to facilitate bus-oriented systems
• Supports wide operating voltage range for standard 5V logic compatibility

Applications

• Bus-oriented memory and data register systems
• Clock drivers and timing circuits
• High-speed data transmission lines

Procurement Notes

Verify the specific suffix G4 indicates lead-free compliance and RoHS standards when sourcing. Confirm the package type matches the required PCB footprint. Check current availability status as component lifecycles may vary. Ensure the supplier provides original manufacturer documentation for quality assurance.

Selection Notes

Select this component for designs requiring high-speed buffering with minimal propagation delay. Consider the SSOP package constraints for board space. Evaluate the three-state capability against system bus isolation requirements. Compare drive strength needs with other FCT series alternatives if higher current is necessary.

Part Context

This part is part of the Texas Instruments FCT (Fast CMOS Technology) series, which bridges the performance gap between standard TTL and advanced CMOS technologies. The FCT family is known for its speed comparable to LS-TTL but with lower power consumption typical of CMOS devices, making it suitable for mixed-logic environments.

Replacement Considerations

Check for direct pin-compatible substitutes within the same FCT family. Verify equivalent electrical characteristics such as output drive current and propagation delay. Ensure any replacement maintains the same package dimensions and thermal properties.