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CY7C1021B-15VXC is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC SRAM 1MBIT PARALLEL 44SOJ. Review the specifications below when checking this part for your BOM.
The CY7C1021B-15VXC is a 1-Mbit (64K x 16) asynchronous static RAM manufactured by Infineon Technologies. It features a maximum access time of 15 ns and operates on a single 5 V power supply within the range of 4.5 V to 5.5 V. The device utilizes CMOS technology for high-speed performance and low active power consumption, with a maximum operating current of 130 mA in commercial and industrial ranges. It includes automatic power-down when deselected and independent control of upper and lower byte data lines.
Verify the specific ordering suffix 'VXC' confirms the 44-pin SOJ package type and Pb-free status as documented in the official datasheet. Confirm the '-15' designation aligns with the required 15 ns access time specifications. Ensure compatibility with standard 5 V logic levels and check for any automotive or industrial qualification requirements if applicable to the target environment.
Select this component for designs requiring a 1-Mbit capacity with a 16-bit word width. The 15 ns access speed suits general-purpose high-speed buffering needs. Consider the 44-pin SOJ package constraints for PCB layout. Evaluate the 130 mA maximum operating current against system power budgets and ensure adequate thermal management for the specified ambient temperature range.
This part belongs to the CY7C1021B family of 1-Mbit Static RAMs. The family offers variations in speed grades (-12, -15) and packages (TSOP II, SOJ). The CY7C1021B series is designed for applications needing reliable volatile memory storage with fast read/write cycles and low standby power characteristics typical of CMOS SRAM architectures.
CY7C1021B-15VXI serves as a direct equivalent within the same package and speed grade but may differ in lead composition. CY7C1021B-15ZC provides the same electrical specifications in a TSOP Type II package, requiring footprint adaptation.
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