CY7C1041CV33-10BAJXET

Memory IC Overview

The CY7C1041CV33-10BAJXET is a 4-Mbit (256 K × 16) CMOS static RAM designed for automotive applications. It operates within the Automotive-E temperature range of –40 °C to +125 °C with a supply voltage of 3.3 V ± 10%. The device features a maximum access time of 10 ns and a maximum operating current of 130 mA. It utilizes a Pb-free 48-ball BGA package.

Memory IC Feature Summary

• Supports independent control of upper and lower bits via Byte Low Enable and Byte High Enable signals
• Features automatic power down when deselected to reduce active power consumption
• Includes data retention capability at 2.0 V

Memory IC Applications

• Automotive electronic systems requiring high-speed memory
• Embedded storage in industrial environments
• Consumer electronics utilizing parallel SRAM interfaces

Memory IC Procurement Notes

Verify component authenticity through authorized Infineon distributors or certified partners. Confirm that the specific ordering code matches the required speed grade, package type, and temperature rating. Ensure compliance with RoHS standards and check for any relevant product change notifications prior to procurement.

Memory IC Selection Notes

Select this component for designs requiring fast asynchronous access and byte-level granularity. Consider the 48-ball BGA footprint for surface mount assembly. Evaluate thermal resistance characteristics against the expected ambient conditions to ensure reliable operation within the specified temperature limits.

Memory IC Part Context

This part belongs to the CY7C1041CV33 family of Fast Asynchronous SRAMs manufactured by Infineon Technologies. It represents an evolution of Cypress Semiconductor's memory portfolio following industry consolidation. The device is optimized for high-performance embedded applications requiring low latency and robust data integrity.

Memory IC Replacement Considerations

Consult official documentation for verified substitute part numbers. Cross-referencing requires matching density, organization, speed grade, and package specifications.