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CY7C1265KV18-400BZC is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC SRAM 36MBIT PARALLEL 165FBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for CY7C1265KV18-400BZC
- Description：IC SRAM 36MBIT PARALLEL 165FBGA
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- Memory Type：Volatile
- Memory Format：SRAM
- Technology：SRAM - Synchronous, QDR II+
- Memory Size：36Mbit
- Memory Organization：1M x 36
- Memory Interface：Parallel
- Clock Frequency：400 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.7V ~ 1.9V
- Operating Temperature：0°C ~ 70°C (TA)
- Mounting Type：Surface Mount
- Package / Case：165-LBGA
- Supplier Device Package：165-FBGA (13x15)
- Access Time：-
Memory IC datasheet and documents for CY7C1265KV18-400BZC
Memory IC Overview
The CY7C1265KV18-400BZC is a QDR II+ synchronous static random-access memory (SRAM) manufactured by Infineon Technologies. It features a storage capacity of 36 Mbit organized as 2M x 18 bits. The device supports a maximum clock frequency of 400 MHz with an access time of 450 ps. It operates within a voltage range of 1.7 V to 1.9 V and utilizes a parallel interface. The component is housed in a 165-ball FBGA package suitable for surface mount technology.
Memory IC Feature Summary
- QDR II+ architecture enabling simultaneous read and write operations
- Synchronous operation with high-speed data transfer capabilities
- Integrated on-die termination for signal integrity
Memory IC Applications
- High-performance networking equipment
- Telecommunications infrastructure
- Data center switching applications
Memory IC Procurement Notes
Verify end-of-life status and availability through authorized distributors, as this component may be discontinued or subject to limited supply constraints. Confirm moisture sensitivity level handling requirements during procurement and storage to ensure device reliability upon installation.
Memory IC Selection Notes
Select this part for designs requiring high-bandwidth memory interfaces with low latency. Ensure the system power supply strictly maintains the 1.7 V to 1.9 V operating range. Verify PCB layout compatibility with the 165-ball FBGA footprint and thermal management requirements for commercial temperature operation.
Memory IC Part Context
This component belongs to the CY7C1265KV18 family of QDR II+ SRAMs. It shares architectural similarities with other members like the CY7C1263KV18 and CY7C1268KV18, differing primarily in organization and speed grades. It represents Infineon's solution for high-throughput memory applications in the 36 Mbit density class.
Memory IC Replacement Considerations
Direct substitutes include CY7C1263KV18-400BZC and CY7C1268KV18-400BZXC. Verify pinout compatibility and electrical specifications before substitution.
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