CY7C1265V18-400BZC

Memory IC Overview

The CY7C1265V18-400BZC is a 36-Mbit QDR-II+ Synchronous Pipelined SRAM with a 1M x 36 organization. It supports clock frequencies up to 400 MHz and features separate independent read and write data ports for concurrent transactions. The device utilizes Double Data Rate (DDR) interfaces on both ports, transferring data at 800 MHz. Key specifications include a 2.5-cycle read latency, a 4-word burst architecture, and operation within a core voltage range of 1.7 V to 1.9 V. It is housed in a 165-ball FBGA package.

Memory IC Feature Summary

• Separate independent read and write data ports enable concurrent transactions without bus turnaround
• Double Data Rate (DDR) interfaces on both read and write ports maximize bandwidth
• Echo clocks simplify data capture in high-speed systems
• Synchronous internally self-timed writes ensure full data coherency

Memory IC Applications

• High-bandwidth networking equipment
• Telecommunications infrastructure
• Data acquisition systems
• Test and measurement instruments

Memory IC Procurement Notes

Verify the specific suffix 'BZC' against official Infineon or Cypress documentation to confirm lead-free status and RoHS compliance, as datasheet revisions may alter packaging details. Confirm availability through authorized distributors, noting that this component family may have reached end-of-life or discontinuation status. Ensure the procurement channel provides valid traceability and authenticity guarantees for legacy memory components.

Memory IC Selection Notes

Select this component when system design requires high throughput with independent read and write paths. The 1M x 36 organization suits applications needing wide data buses. Verify that the host controller supports QDR-II+ timing protocols and can handle the 400 MHz clock frequency. Ensure power supply rails match the specified 1.8 V core and 1.4 V to 1.9 V I/O requirements.

Memory IC Part Context

This part belongs to the CY7C126x/1276V18 family of 36-Mbit QDR-II+ SRAMs. Other members include CY7C1261V18 (4M x 8), CY7C1276V18 (4M x 9), and CY7C1263V18 (2M x 18). All share the same QDR-II+ architecture, 165-ball FBGA package, and general functional characteristics, differing primarily in data width and depth.

Memory IC Replacement Considerations

Direct replacements within the same family include CY7C1265KV18-400BZXC. Verify pinout compatibility and electrical specifications before substitution. Cross-family replacements require careful review of timing parameters and interface protocols.