Memory IC CY7C1305TV25-167BZC product image

CY7C1305TV25-167BZC

  • Description:IC SRAM 18MBIT PAR 165FBGA
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bag

SKU:758a7d36be97 Category: Brand:

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CY7C1305TV25-167BZC is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC SRAM 18MBIT PAR 165FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for CY7C1305TV25-167BZC

  • Description:IC SRAM 18MBIT PAR 165FBGA
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bag
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, QDR
  • Memory Size:18Mbit
  • Memory Organization:1M x 18
  • Memory Interface:Parallel
  • Clock Frequency:167 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.4V ~ 2.6V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for CY7C1305TV25-167BZC

CY7C1305TV25-167BZC

Memory IC Overview

The CY7C1305TV25-167BZC is an 18-Mbit Synchronous Quad Data Rate (QDR) SRAM manufactured by Infineon Technologies. It features a memory organization of 1M x 18 bits and supports a maximum clock frequency of 167 MHz with a typical access time of 2.5 ns. The device operates within a voltage range of 2.375 V to 2.625 V and utilizes a parallel interface. It is housed in a 165-pin FBGA package, designed for surface mount installation, and supports industrial temperature ranges.

Memory IC Feature Summary

  • Supports QDR II architecture for simultaneous read and write operations at the same clock rate
  • Includes on-chip data integrity mechanisms such as ECC and parity checking
  • Features independent dual-port capability allowing concurrent host and peripheral access

Memory IC Applications

  • High-speed networking equipment requiring low-latency packet buffering
  • Telecommunications infrastructure systems
  • Industrial automation control units

Memory IC Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels due to potential availability constraints. Confirm RoHS compliance status and specific packaging requirements against current Infineon documentation before procurement. Ensure supply chain stability given the component's specialized nature and potential end-of-life considerations.

Memory IC Selection Notes

Select this component when simultaneous bidirectional data throughput is required without bus turnaround delays. It is suitable for applications demanding deterministic latency and high bandwidth. Compare against standard synchronous SRAMs if single-direction access suffices to optimize cost. Verify voltage compatibility with system power rails.

Memory IC Part Context

This part belongs to the Cypress/Infineon QDR SRAM family, designed for high-performance embedded applications. It complements other members like the CY7C1303 series but offers distinct port configurations. The technology bridges the gap between fast DRAM and complex FPGA memories, providing ease of use with high speed.

Memory IC Replacement Considerations

Check for pin-compatible alternatives within the CY7C13xx series. Verify functional equivalence regarding ECC implementation and timing parameters. Consider newer generations from Infineon if long-term supply assurance is critical.

CY7C1305TV25-167BZCCY7C1305TV25-167BZC

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