Memory IC CY7C1347G-200AXCT product image

CY7C1347G-200AXCT

  • Description:IC SRAM 4.5MBIT PAR 100TQFP
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR)

SKU:05f1a4290f94 Category: Brand:

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CY7C1347G-200AXCT is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC SRAM 4.5MBIT PAR 100TQFP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for CY7C1347G-200AXCT

  • Description:IC SRAM 4.5MBIT PAR 100TQFP
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, SDR
  • Memory Size:4.5Mbit
  • Memory Organization:128K x 36
  • Memory Interface:Parallel
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:3.15V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:100-LQFP
  • Supplier Device Package:100-TQFP (14x20)
  • Access Time:2.8 ns

Memory IC datasheet and documents for CY7C1347G-200AXCT

CY7C1347G-200AXCT

Memory IC Overview

The CY7C1347G-200AXCT is a 4-Mbit (128K × 36) pipelined synchronous SRAM manufactured by Infineon Technologies. It operates at a maximum clock frequency of 200 MHz with a maximum access time of 2.8 ns. The device utilizes a 3.3 V core supply and supports 2.5 V or 3.3 V I/O levels. It features fully registered inputs and outputs, user-selectable burst sequences, and separate processor and controller address strobes.

Memory IC Feature Summary

  • Fully registered inputs and outputs for pipelined operation
  • User selectable burst counter supporting Intel Pentium interleaved or linear burst sequences
  • Separate processor and controller address strobes
  • Synchronous self timed writes

Memory IC Applications

  • Secondary cache systems
  • Intel Pentium processor applications
  • Power PC processor applications

Memory IC Procurement Notes

Verify the specific suffix AXCT against official Infineon documentation to confirm package type and reel specifications. Confirm that the ZZ pin is externally connected to ground as required by the silicon errata. Ensure voltage levels match the 3.3 V core and 2.5 V/3.3 V I/O requirements before integration.

Memory IC Selection Notes

Select this component when a 128K x 36 organization is required for secondary cache designs. The 200 MHz speed grade offers a balance between performance and power consumption compared to higher speed variants. Verify compatibility with the target processor's burst sequence requirements via the MODE pin configuration.

Memory IC Part Context

This part belongs to the CY7C1347G family of 4-Mbit synchronous SRAMs. It is designed to support zero-wait-state secondary cache with minimal glue logic. The device is offered in a Pb-free 100-pin TQFP package and is available in commercial temperature ranges.

Memory IC Replacement Considerations

Check for CY7C1347G-250AXCT for faster performance or CY7C1347G-166AXCT for lower power consumption. Verify pinout and electrical characteristics compatibility before substitution.

Memory IC FAQ

How is the burst sequence selected?

The burst sequence is user-selectable through the MODE input pin. Tying it to GND selects the linear burst sequence, while tying it to VDDQ or leaving it floating selects the interleaved burst sequence.

What is the function of the ZZ pin?

The ZZ pin is an asynchronous sleep input. Asserting it HIGH places the device in a power conservation sleep mode while preserving data integrity. According to errata, this pin must be externally connected to ground during normal operation.

CY7C1347G-200AXCTCY7C1347G-200AXCT

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