CY7C1354S-200BGC

Memory IC Overview

The CY7C1354S-200BGC is a 9-Mbit (256K x 36) pipelined synchronous SRAM from Cypress Semiconductor. It utilizes NoBL architecture to reduce power consumption during non-burst accesses. The device operates at a clock frequency of 200 MHz with an access time of 3.2 ns. It supports a supply voltage range of 3.135V to 3.6V and functions within a commercial temperature range of 0°C to 70°C. The component is housed in a 119-pin PBGA package.

Memory IC Feature Summary

• Implements NoBL architecture for reduced power consumption during non-burst operations
• Provides high-speed data transfer via pipelined synchronous interface
• Supports flexible memory organization configurations

Memory IC Applications

• High-performance networking equipment
• Telecommunications infrastructure systems
• Industrial automation control units

Memory IC Procurement Notes

Verify the specific suffix 'S' against official Cypress documentation to confirm package type and RoHS compliance status, as variations exist within the CY7C1354 family. Confirm availability through authorized distributors or secondary market suppliers due to potential end-of-life status. Ensure environmental specifications match application requirements.

Memory IC Selection Notes

Select this component when a 9-Mbit capacity with 36-bit width is required for synchronous applications. Compare against the CY7C1354C variant if lead-free packaging is mandatory. Evaluate thermal performance within the 0°C to 70°C operating range. Consider pin compatibility with existing PCB layouts designed for 119-pin BGA packages.

Memory IC Part Context

This part belongs to the CY7C1354 series of NoBL Pipelined Sync SRAMs. It shares architectural similarities with the CY7C1354C and CY7C1356 models but differs in package configuration and specific speed grades. The series is designed for applications requiring low power and high bandwidth memory solutions.

Memory IC Replacement Considerations

The CY7C1354C-200BGC is a functionally similar alternative within the same family. Verify package dimensions and electrical characteristics before substitution.