Memory IC CY7C1360C-200BGC product image

CY7C1360C-200BGC

  • Description:IC SRAM 9MBIT PARALLEL 119PBGA
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray

SKU:512bccaf693d Category: Brand:

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CY7C1360C-200BGC is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC SRAM 9MBIT PARALLEL 119PBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for CY7C1360C-200BGC

  • Description:IC SRAM 9MBIT PARALLEL 119PBGA
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, SDR
  • Memory Size:9Mbit
  • Memory Organization:256K x 36
  • Memory Interface:Parallel
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:3.135V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:119-BGA
  • Supplier Device Package:119-PBGA (14x22)
  • Access Time:3 ns

Memory IC datasheet and documents for CY7C1360C-200BGC

CY7C1360C-200BGC

Memory IC Overview

The CY7C1360C-200BGC is a 9-Mbit synchronous static random-access memory (SRAM) organized as 256K words by 36 bits. It operates at a maximum clock frequency of 200 MHz with a pipeline read latency of one cycle. The device utilizes a parallel interface and functions within an operating voltage range of 3.14 V to 3.63 V. It supports commercial temperature conditions from 0°C to 70°C and is housed in a 119-ball PBGA package.

Memory IC Feature Summary

  • Pipelined architecture enabling single-cycle data retrieval after initial latency
  • High-speed synchronous operation supporting up to 200 MHz clock rates
  • Wide 36-bit data bus configuration for high-bandwidth applications

Memory IC Applications

  • High-performance networking equipment requiring low-latency buffering
  • Telecommunications infrastructure systems
  • Industrial control systems demanding fast data access

Memory IC Procurement Notes

Verify the specific suffix BGC confirms the 119-ball PBGA package and Sn/Pb lead finish. Confirm the 200 MHz speed grade matches system timing requirements. Check current lifecycle status as older synchronous SRAM variants may face discontinuation or limited availability. Ensure RoHS compliance needs align with the leaded finish specification.

Memory IC Selection Notes

Select this component when a 36-bit data width is required for wide-bus architectures. The pipelined design suits applications needing consistent throughput over burst transfers. Compare against NoBL alternatives if lower power consumption during idle states is critical. Verify that the 119-ball BGA footprint fits the target PCB layout constraints.

Memory IC Part Context

This part belongs to the Infineon Standard Sync SRAM family, designed for high-speed data processing. It complements other CY7C136x series devices offering varying organizations like 18-bit widths. The technology represents mature synchronous memory solutions for embedded systems requiring deterministic access times.

Memory IC Replacement Considerations

Direct pin-compatible replacements are limited due to specific package and speed variations. Review the CY7C1360C datasheet for alternative speed grades or package options within the same family. Cross-reference with newer generation SRAMs only if architectural compatibility allows.

CY7C1360C-200BGCCY7C1360C-200BGC

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