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CY7C1413BV18-200BZC is listed in the Memory IC range at ChipApex. The manufacturer field lists Cypress Semiconductor Corp. Its product description is IC SRAM 36MBIT PARALLEL 165FBGA. Review the specifications below when checking this part for your BOM.
The CY7C1413BV18-200BZC is a 36-Mbit QDR-II SRAM with a 2M x 18 organization. It operates at a maximum frequency of 200 MHz using a 1.8V core voltage and 1.4V to VDD I/O supply. The device features separate independent read and write ports, supporting concurrent transactions without bus turnaround. It utilizes a 165-ball FBGA package (15x17 mm) and includes a Delay Lock Loop for accurate data placement.
Verify the specific speed grade suffix matches the required operating frequency. Confirm RoHS compliance status as older revisions may not meet current environmental standards. Ensure the package type corresponds to the target PCB footprint. Check for lead-free versus non-lead-free options if required by assembly processes.
Select this component when dual-port concurrency is necessary to maximize throughput. The 2M x 18 configuration suits applications needing wide data paths. Consider the 200 MHz speed grade for system timing constraints. Evaluate the 165-ball FBGA package size against available board space.
This part belongs to the Cypress CY7C141xBV18 family of QDR-II SRAMs. It shares architectural similarities with the CY7C1411BV18, CY7C1426BV18, and CY7C1415BV18, differing primarily in memory density and data width. All members utilize the same 165-ball FBGA package and QDR-II interface protocol.
Direct substitutes within the same family include CY7C1411BV18, CY7C1426BV18, and CY7C1415BV18, provided the memory organization fits the design. Speed grades such as -250BZC or -278BZC offer higher frequencies but require timing verification.
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