CY7C1425JV18-250BZC

Memory IC Overview

The CY7C1425JV18-250BZC is a 36-Mbit QDR-II SRAM with a 4M x 9 organization. It operates at a maximum clock frequency of 250 MHz, delivering data at 500 MHz via double data rate interfaces on both read and write ports. The device features separate independent read and write data ports to support concurrent transactions without bus turnaround. It utilizes a single multiplexed address input bus for both ports and includes echo clocks (CQ/CQ) to simplify high-speed system design. The core voltage is 1.8V ±0.1V, while I/O voltage ranges from 1.4V to VDD.

Memory IC Feature Summary

• Separate independent read and write data ports enable concurrent transactions and eliminate data bus turnaround requirements.
• Double data rate interfaces on both read and write ports maximize bandwidth by transferring data on every rising edge of the input clocks.
• Echo clocks (CQ and CQ) are synchronized to output clocks to simplify data capture in high-speed systems.
• Single multiplexed address input bus latches addresses for both read and write operations, minimizing pin count.

Memory IC Applications

• High-bandwidth networking equipment requiring parallel interface memory
• Telecommunications infrastructure utilizing synchronous burst architectures
• Industrial control systems needing concurrent read/write access

Memory IC Procurement Notes

Verify the specific suffix 'JV18' against official Cypress/Infineon documentation to confirm it denotes the 250 MHz speed grade and Pb-free package variant. Ensure the ordering code matches the exact 165-ball FBGA configuration required for your PCB footprint. Cross-reference the manufacturer's latest datasheet revision to confirm current status and any potential obsolescence notices associated with this component family.

Memory IC Selection Notes

Select this component when a 36-Mbit capacity with a 4M x 9 word width is required for QDR-II applications. It is suitable for designs demanding 250 MHz operation with independent read and write ports. Consider the 165-ball FBGA package dimensions and the 1.8V core voltage requirement. Ensure the system supports the necessary HSTL I/O standards and provides the required reference voltage for impedance matching.

Memory IC Part Context

This part belongs to the CY7C14xxJV18 family of 36-Mbit QDR-II SRAMs. Other members include CY7C1410JV18 (4M x 8), CY7C1412JV18 (2M x 18), and CY7C1414JV18 (1M x 36). All share the same QDR-II architecture, 165-ball FBGA package, and general functional characteristics, differing primarily in data width and internal array organization.

Memory IC Replacement Considerations

CY7C1425KV18-250BZC is a documented substitute within the same product family, offering identical functionality and pinout compatibility.