CY7C1426UV18-300BZC

Memory IC Overview

The CY7C1426UV18-300BZC is a QDR-II synchronous static random-access memory (SRAM) manufactured by Infineon Technologies. It features a density of 36 Mbit with an organization of 4M x 9. The device operates at a maximum clock frequency of 300 MHz and supports parallel interfaces. It functions within a supply voltage range of 1.7 V to 1.9 V and is rated for commercial temperature operation from 0°C to 70°C. The component utilizes a 165-ball FBGA package measuring 13x15 mm.

Memory IC Feature Summary

• Synchronous Quad Data Rate II architecture for high-speed data throughput
• Parallel interface supporting standard SRAM control signals
• Low-voltage operation compatible with 1.8V logic systems

Memory IC Applications

• High-performance networking equipment
• Telecommunications infrastructure
• Industrial automation controllers

Memory IC Procurement Notes

Verify the specific suffix 'U' against official Infineon documentation, as it may indicate a non-RoHS compliant variant or specific lead finish distinct from the 'K' series. Confirm availability status, as older QDR-II parts may be discontinued or subject to last-time buys. Ensure the 165-FBGA footprint matches the target PCB design constraints before procurement.

Memory IC Selection Notes

Select this part when a 36 Mbit capacity with 4M x 9 organization is required for synchronous applications. The 300 MHz speed grade suits designs needing low-latency access. Compare against the CY7C1426KV18-300BZC if industrial temperature ratings (-40°C to 85°C) are necessary instead of commercial grades. Ensure the system power budget accommodates the dynamic current requirements of QDR-II technology.

Memory IC Part Context

This component belongs to the Cypress/Infineon QDR-II family of synchronous SRAMs, designed for bandwidth-intensive applications. It succeeds earlier generations like QDR-I and precedes newer QDR-III variants. The part integrates on-die termination and precise timing characteristics typical of the QDR architecture, facilitating easy integration into high-speed bus systems without external termination components.

Memory IC Replacement Considerations

The CY7C1426KV18-300BZC is a pin-compatible alternative offering industrial temperature range qualification. For higher densities, consider the CY7C1512KV18-300BZXI (72 Mbit). Verify that any substitute maintains the same 165-FBGA package dimensions and electrical specifications to ensure board compatibility.