Memory IC CY7C1512V18-200BZI product image

CY7C1512V18-200BZI

$128.18
  • Description:IC SRAM 72MBIT PARALLEL 165FBGA
  • Series:-
  • Mfr:Cypress Semiconductor Corp
  • Package:Tray

SKU:8b683b8a4843 Category: Brand:

  
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CY7C1512V18-200BZI is listed in the Memory IC range at ChipApex. The manufacturer field lists Cypress Semiconductor Corp. Its product description is IC SRAM 72MBIT PARALLEL 165FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for CY7C1512V18-200BZI

  • Description:IC SRAM 72MBIT PARALLEL 165FBGA
  • Series:-
  • Mfr:Cypress Semiconductor Corp
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, QDR II
  • Memory Size:72Mbit
  • Memory Organization:4M x 18
  • Memory Interface:Parallel
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FBGA (15x17)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for CY7C1512V18-200BZI

CY7C1512V18-200BZI

Memory IC Overview

The CY7C1512V18-200BZI is a 72-Mbit QDR-II SRAM with a 4M x 18 organization. It supports a maximum operating frequency of 200 MHz and utilizes a 2-word burst architecture for high bandwidth. The device features separate independent read and write data ports, enabling concurrent transactions without bus turnaround. It operates with a core voltage (VDD) of 1.8V and an I/O voltage (VDDQ) ranging from 1.4V to VDD. The component is housed in a 165-ball FBGA package measuring 15 x 17 x 1.4 mm.

Memory IC Feature Summary

  • Dual-port architecture with dedicated read and write interfaces for simultaneous operations
  • Double Data Rate (DDR) interface on both ports for increased throughput
  • Echo clocks (CQ/CQ) provided to simplify data capture timing
  • Programmable output impedance via ZQ pin for system bus matching

Memory IC Applications

  • High-speed networking equipment requiring low latency buffering
  • Telecommunications systems utilizing packet switching
  • Data routing applications demanding concurrent access capabilities

Memory IC Procurement Notes

Verify the specific speed grade suffix '200' matches the required 200 MHz operational frequency. Confirm the 'BZI' suffix indicates the correct lead-free packaging and commercial temperature range specifications. Ensure the 165-ball FBGA footprint aligns with the target PCB layout constraints before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 72-Mbit capacity with a 18-bit word width is required. Choose the 200 MHz variant if the system clock does not exceed this limit. Consider the QDR-II architecture for designs needing full-duplex data transfer without bus contention. Verify that the 1.8V core voltage supply is available for the target application environment.

Memory IC Part Context

This part belongs to the Cypress Semiconductor QDR-II SRAM family, which includes variants like the CY7C1510V18 and CY7C1514V18. These devices share the same pipelined burst architecture and physical package dimensions but differ in memory density and data bus width configurations.

Memory IC Replacement Considerations

CY7C1512KV18-200BZI

Memory IC FAQ

How are read and write addresses managed?

Address inputs are multiplexed for both ports. Read addresses are latched on the rising edge of the positive input clock (K), while write addresses are latched on the rising edge of the negative input clock (K#).

What is the function of the DOFF pin?

The DOFF pin is used to disable the internal Delay Lock Loop (DLL). Connecting this pin to ground turns off the DLL, altering the device's timing characteristics.

CY7C1512V18-200BZICY7C1512V18-200BZI
$128.18
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