CY7C1525KV18-250BZXI

Memory IC Overview

The CY7C1525KV18-250BZXI is a 72-Mbit QDR II SRAM with an 8M x 9 organization. It operates at a maximum clock frequency of 250 MHz, providing data transfer rates up to 700 MHz via double data rate interfaces on both read and write ports. The device features separate independent read and write data ports, supporting concurrent transactions without bus turnaround delays. It utilizes a 165-ball FBGA package (13 x 15 x 1.4 mm) and supports core voltage of 1.8V ±0.1V with I/O VDDQ ranging from 1.4V to VDD.

Memory IC Feature Summary

• Supports concurrent read and write operations through separate independent data ports
• Features a 2-word burst architecture for sequential data transfers
• Includes echo clocks (CQ/CQ) to simplify high-speed system data capture
• Provides programmable output impedance matching via the ZQ pin

Memory IC Applications

• High-bandwidth networking equipment
• Telecommunications infrastructure systems
• Industrial automation controllers

Memory IC Procurement Notes

Verify the specific speed grade suffix matches the required 250 MHz operational frequency. Confirm that the BZXI suffix corresponds to the correct lead-free packaging and RoHS compliance status as defined in the manufacturer's ordering guide. Ensure the procurement channel provides valid traceability documentation for industrial-grade components.

Memory IC Selection Notes

Select this component when a 72-Mbit capacity with an 8-bit wide data interface is required. The 250 MHz speed grade offers a balance between performance and power consumption compared to higher-frequency variants. Consider the 165-ball FBGA footprint constraints during PCB layout planning to ensure adequate clearance for the package dimensions.

Memory IC Part Context

This part belongs to the Cypress CY7C1525KV18 series of QDR II SRAMs. It shares architectural similarities with the CY7C1510KV18, CY7C1512KV18, and CY7C1514KV18, differing primarily in memory organization and data width configurations. All members utilize the same 165-ball FBGA package and synchronous pipelined architecture.

Memory IC Replacement Considerations

Direct replacements within the same family include the CY7C1525KV18-333BZC for higher frequency requirements or the CY7C1525AV18-250BZXI if non-lead-free packaging is acceptable. Verify pin compatibility and electrical characteristics before substitution.