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CY7C2644KV18-300BZXI is listed in the Memory IC range at ChipApex. The manufacturer field lists Cypress Semiconductor Corp. Its product description is IC SRAM 144MBIT PAR 165FBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for CY7C2644KV18-300BZXI
- Description：IC SRAM 144MBIT PAR 165FBGA
- Series：-
- Mfr：Cypress Semiconductor Corp
- Package：Tray
- Memory Type：Volatile
- Memory Format：SRAM
- Technology：SRAM - Synchronous, QDR II+
- Memory Size：144Mbit
- Memory Organization：4M x 36
- Memory Interface：Parallel
- Clock Frequency：300 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.7V ~ 1.9V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：165-LBGA
- Supplier Device Package：165-FBGA (15x17)
- Access Time：-
Memory IC datasheet and documents for CY7C2644KV18-300BZXI
Memory IC Overview
The CY7C2644KV18-300BZXI is a QDR II+ synchronous SRAM memory IC manufactured by Cypress Semiconductor Corp. It features a storage capacity of 144 Mbit organized as 4M x 36 bits. The device operates with a parallel interface and supports clock frequencies up to 300 MHz. It utilizes a 165-FBGA package measuring 15x17 mm. Power supply requirements are specified between 1.7V and 1.9V, and it functions within an ambient temperature range of -40°C to 85°C.
Memory IC Feature Summary
- Supports high-speed data transfer via QDR II+ technology
- Provides wide 36-bit data path for efficient processing
- Operates on low voltage power supply
- Designed for industrial temperature environments
Memory IC Applications
- High-performance networking equipment
- Telecommunications infrastructure systems
- Industrial automation control units
Memory IC Procurement Notes
Verify the specific suffix BZXI against official Cypress documentation to confirm package dimensions and pinout compatibility. Ensure the operating voltage range aligns with system power rails. Confirm RoHS compliance status through current manufacturer certificates before integration into regulated assemblies.
Memory IC Selection Notes
Select this component when a wide 36-bit data bus is required for high-throughput applications. The QDR II+ architecture offers deterministic latency compared to standard SRAMs. Consider the 165-FBGA footprint for PCB layout constraints. Verify thermal management capabilities for the specified industrial temperature range during design phase.
Memory IC Part Context
This part belongs to the CY7C2644 family of QDR II+ memories. It shares architectural similarities with other devices in the series but differs in organization and speed grades. The KV18 designation indicates the specific voltage and package variant within the broader product line managed by Cypress Semiconductor.
Memory IC Replacement Considerations
Check for CY7C2644 variants with different speed grades or organizations. Verify pin-to-pin compatibility with existing designs before substitution. Consult official cross-reference guides for confirmed equivalents.
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