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The CY8CPLC10-28PVXIT is a dedicated Power Line Communications (PLC) network controller and processor IC from Infineon Technologies. It integrates an FSK physical layer modem with the M8C core to enable bidirectional half-duplex communication over AC/DC power lines. The device operates at a maximum data rate of 2400 bit/s within the 24 MHz frequency band. It supports I2C, SPI, and UART interfaces for host connectivity. Electrical specifications include a supply voltage range of 4.75 V to 5.25 V, a typical operating current of 50 mA, and a functional temperature range from -40 °C to +85 °C. The component is housed in a 28-pin SSOP package.
Verify the specific suffix 'T' indicates tape-and-reel packaging when sourcing components. Confirm RoHS compliance status through official manufacturer documentation prior to assembly. Ensure ESD handling protocols are followed during storage and installation. Cross-reference the full part number against the latest datasheet revision to confirm pinout and electrical characteristics match design requirements.
Select this component for applications requiring fixed-function PLC capabilities without complex analog front-end design. The integrated M8C core reduces external component count compared to separate PHY and MCU solutions. Consider the 28-pin SSOP package constraints for PCB layout. Evaluate thermal performance within the specified operating temperature range. Verify that the 2400 bit/s data rate meets application latency requirements.
This device belongs to the CY8CPLC10 series of dedicated power line communication controllers. It shares architectural similarities with other Infineon PLC solutions but offers a fixed-function approach optimized for cost-sensitive applications. The series utilizes the M8C processor core common across several Infineon embedded controller families.
The CY8CPLC10-28PVXI is the tube-packaged equivalent of this component. Both variants share identical electrical and functional specifications. Selection between them depends solely on manufacturing packaging preferences for surface-mount assembly processes.