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CY9AF114LPMC1-G-MJE1 is listed in the Microcontrollers range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC MCU 32BIT FLASH LQFP. Review the specifications below when checking this part for your BOM.
The CY9AF114LPMC1-G-MJE1 is a 32-bit microcontroller from Infineon Technologies, belonging to the MB9A110 series. It integrates an ARM Cortex-M3 core operating at a maximum clock frequency of 40 MHz. The device features 256 kB of Flash program memory and 32 kB of SRAM data RAM. It provides 83 general-purpose I/O pins and includes a 12-bit ADC with 16 channels. The unit supports CSIO, I2C, LIN, and UART interfaces, operates within a voltage range of 2.7 V to 5.5 V, and functions between -40°C and +105°C in a QFP-100 package.
Verify component authenticity through authorized Infineon distributors or certified partners. Confirm the specific suffix codes match project requirements for package and temperature grade. Request official datasheets and RoHS compliance documentation prior to integration. Ensure supply chain stability as availability may be restricted. Validate pin compatibility during PCB layout finalization.
Select this model when a 40 MHz Cortex-M3 solution with 256 kB Flash is required. Choose the QFP-100 package for surface-mount assembly needs. Consider the 2.7 V to 5.5 V operating range for flexible power design. Verify that 83 available I/O lines meet interface demands. Ensure the -40°C to +105°C temperature rating suits the operational environment.
This component belongs to the MB9A110 family of ARM-based microcontrollers. It shares architectural similarities with other CY9AF1xx variants but differs in memory size and package configuration. The FM3 series designation indicates its classification within Infineon's broader portfolio of high-performance 32-bit controllers designed for demanding embedded applications.
Consult official substitution lists for equivalent parts within the MB9A110 series. Verify pin-to-pin compatibility before replacing the existing component. Check for differences in memory capacity or peripheral availability. Ensure thermal and electrical specifications align with current design constraints.
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