CYBL10563-68FLXIT

RF Transceiver ICS Overview

The CYBL10563-68FLXIT is a Bluetooth Low Energy (BLE) Smart System-On-Chip (SoC) from Infineon Technologies. It integrates an RF transceiver with a microcontroller, supporting the Bluetooth v4.1 protocol at 2.4 GHz using GFSK modulation. The device operates within a voltage range of 1.9 V to 5 V and features a 68-XFBGA WLCSP package. It supports UART interfaces and SMA antenna connectors for development kits like the CY8CKIT-002 and CY8CKIT-042.

RF Transceiver ICS Feature Summary

• Integrates RF transceiver and microcontroller in a single SoC
• Supports Bluetooth v4.1 protocol with GFSK modulation
• Operates on wide supply voltage range from 1.9 V to 5 V

RF Transceiver ICS Applications

• Bluetooth Low Energy development tools
• Evaluation modules for BLE systems
• Smart IoT devices requiring integrated RF and MCU

RF Transceiver ICS Procurement Notes

Verify component authenticity through authorized Infineon distributors. Confirm package integrity upon receipt. Check datasheet revisions for updated electrical characteristics. Ensure storage conditions meet semiconductor standards. Validate compatibility with target application requirements before deployment.

RF Transceiver ICS Selection Notes

Select this SoC for applications requiring integrated BLE connectivity and processing. Consider the 68-XFBGA package for surface mount assembly. Evaluate power consumption specs against system battery life requirements. Verify interface compatibility with host controllers. Assess thermal performance for enclosed environments.

RF Transceiver ICS Part Context

This component belongs to Infineon's CYBL series of Bluetooth Low Energy System-On-Chips. It is designed for compact wireless applications combining radio frequency transmission/reception with embedded control capabilities. The series targets cost-sensitive and space-constrained IoT deployments requiring reliable BLE communication.

RF Transceiver ICS Replacement Considerations

Check official Infineon documentation for direct pin-to-pin replacements. Verify functional equivalence for Bluetooth v4.1 support. Confirm package compatibility for existing PCB layouts. Review updated feature sets in newer generations.