Memory IC CYD18S36V18-167BBAI product image

CYD18S36V18-167BBAI

  • Description:IC SRAM 18MBIT PAR 256FBGA
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray

SKU:a24de950bb61 Category: Brand:

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CYD18S36V18-167BBAI is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC SRAM 18MBIT PAR 256FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for CYD18S36V18-167BBAI

  • Description:IC SRAM 18MBIT PAR 256FBGA
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Dual Port, Synchronous
  • Memory Size:18Mbit
  • Memory Organization:512K x 36
  • Memory Interface:Parallel
  • Clock Frequency:167 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.42V ~ 1.58V, 1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FBGA (17x17)
  • Access Time:4 ns

Memory IC datasheet and documents for CYD18S36V18-167BBAI

CYD18S36V18-167BBAI

Memory IC Overview

The CYD18S36V18-167BBAI is a 9-Mbit (512K x 36) synchronous dual-port SRAM from the FullFlex36 family. It supports a maximum clock frequency of 167 MHz with a typical access time of 4.0 ns. The device operates on a 1.8 V core supply and features selectable I/O standards including LVTTL, HSTL, and LVCMOS. It utilizes a 256-ball FBGA package.

Memory IC Feature Summary

  • True dual-port architecture enabling simultaneous independent access to the shared memory array from both ports.
  • Built-in deterministic access control logic that manages address collisions during concurrent operations by asserting busy flags.
  • Configurable pipelined or flow-through operational modes to optimize latency and throughput requirements.
  • Integrated variable impedance matching (VIM) and echo clocking capabilities to enhance high-speed signal integrity.

Memory IC Applications

  • High-performance networking equipment requiring low-latency packet buffering
  • Telecommunications infrastructure utilizing synchronous data transfer protocols
  • Industrial automation systems demanding reliable dual-port memory interfaces

Memory IC Procurement Notes

Verify component authenticity through authorized Infineon distributors. Confirm RoHS compliance status and moisture sensitivity level prior to assembly. Review official termination notifications for lifecycle management. Ensure ESD protection measures are implemented during handling and storage.

Memory IC Selection Notes

Select this model for applications requiring 9-Mbit capacity with a 36-bit data width. Verify compatibility with 167 MHz system clocks and 4.0 ns access timing constraints. Ensure the design accommodates the 256-ball FBGA footprint and thermal dissipation requirements.

Memory IC Part Context

This component belongs to the Cypress/Infineon FullFlex SDR Dual-Port SRAM portfolio. It shares architectural similarities with the CYD36S36V18 and CYD09S36V18 variants within the FullFlex36 family, differing primarily in density and pinout configurations.

Memory IC Replacement Considerations

Consult official documentation for qualified substitutes such as CYD09S36V18 or CYD36S36V18. Verify pin compatibility and electrical specifications before implementation.

Memory IC FAQ

How does the device handle simultaneous access to the same memory location?

The device employs built-in deterministic access control to manage collisions. When both ports attempt to access the same address simultaneously, the logic asserts a BUSY output signal to indicate the conflict.

What I/O voltage standards are supported by this SRAM?

Each port independently supports selectable I/O standards, including single-ended HSTL Class I, LVTTL (3.3 V), 2.5 V LVCMOS, and 1.8 V LVCMOS, configured via PORTSTD pins.

CYD18S36V18-167BBAICYD18S36V18-167BBAI

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