Telecom CYP15G0401DXB-BGXC product image

CYP15G0401DXB-BGXC

$274.78
  • Description:IC TELECOM INTERFACE 256BGA
  • Series:HOTlink II™

SKU:2ce9f146f00b Category: Brand:

  
  • Quantity
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CYP15G0401DXB-BGXC is listed in the Telecom range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC TELECOM INTERFACE 256BGA. Review the specifications below when checking this part for your BOM.

Telecom specifications for CYP15G0401DXB-BGXC

  • Description:IC TELECOM INTERFACE 256BGA
  • Series:HOTlink II™
  • Mfr:Infineon Technologies
  • Package:Tray
  • Function:Transceiver
  • Interface:LVTTL
  • Number of Circuits:4
  • Voltage - Supply:3.135V ~ 3.465V
  • Current - Supply:830mA
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:256-BGA Exposed Pad
  • Supplier Device Package:256-L2BGA (27x27)
  • Power (Watts):-
  • Grade:-
  • Qualification:-

Telecom datasheet and documents for CYP15G0401DXB-BGXC

CYP15G0401DXB-BGXC

Telecom Overview

The CYP15G0401DXB-BGXC is a Quad HOTLink II Transceiver manufactured by Infineon Technologies. It operates within a supply voltage range of 3.135 V to 3.465 V and draws a maximum operating current of 830 mA. The device supports four independent channels and utilizes an LVTTL interface. It is housed in a 256-L2BGA package with dimensions of 27x27 mm, designed for surface mount installation. The component functions reliably across an industrial temperature range from 0°C to +70°C.

Telecom Feature Summary

  • Integrates four independent serial transceivers within a single integrated circuit
  • Supports high-speed data transmission via the proprietary HOTLink II protocol
  • Features low voltage TTL (LVTTL) compatible input and output interfaces

Telecom Applications

  • High-performance telecommunications infrastructure equipment
  • Industrial automation control systems requiring reliable serial communication
  • Test and measurement instrumentation platforms

Telecom Procurement Notes

Verify component authenticity through authorized distribution channels due to limited availability status. Confirm that the specific suffix matches the required pinout and electrical specifications for the target design. Ensure proper handling procedures are followed given the moisture sensitivity classification associated with this BGA package type.

Telecom Selection Notes

Select this component when a quad-channel serial transceiver solution is required for board-level interconnects. Compare power consumption characteristics against alternative HOTLink variants to ensure compliance with system thermal constraints. Verify that the 256-ball grid array footprint aligns with the printed circuit board layout capabilities and assembly equipment specifications.

Telecom Part Context

This part belongs to the HOTLink II family of video and serial communication integrated circuits produced by Infineon Technologies. The series provides scalable solutions for point-to-point and multi-drop serial links. The CY prefix indicates its origin from the Cypress Semiconductor product line prior to acquisition.

Telecom Replacement Considerations

Publicly confirmed substitute part numbers for this specific model were not identified in available documentation. Engineering teams should consult official obsolescence notices or contact the manufacturer directly for validated replacement recommendations.

CYP15G0401DXB-BGXCCYP15G0401DXB-BGXC
$274.78
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