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CYW20732E is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IOT BLUETOOTH 802.15.4. Review the specifications below when checking this part for your BOM.
The CYW20732E is a Bluetooth Low Energy (BLE) System-in-Package (SiP) manufactured by Infineon Technologies. It integrates the CYW20735B1 radio with external memory components to provide a compact, low-power solution for wireless applications. The device operates at a frequency of 2.4 GHz and supports BLE protocols. Key specifications include a maximum clock frequency of 24 MHz, 384 kB of RAM, and 2 MB of ROM. It features a 60-VFQFN package with exposed pad, designed for surface mount installation. The unit supports serial interfaces including ADC, I2C, I2S, PCM, PWM, SPI, and UART. Operating voltage ranges from 1.62 V to 3.63 V, with an operating temperature range of -30°C to +85°C.
Verify the specific suffix 'E' against official Infineon documentation to confirm pinout and memory configuration. Check current lifecycle status as some variants may be marked as Not Recommended for New Designs. Ensure compatibility with required antenna design and RF layout guidelines specified in the datasheet. Confirm moisture sensitivity level handling procedures during assembly.
Select this SiP when a compact form factor is critical alongside substantial internal memory requirements. Compare against discrete MCU solutions if board space allows for greater flexibility. Consider the integrated nature of the radio and memory which simplifies BOM management but limits post-production memory upgrades. Evaluate power consumption profiles against specific duty cycle requirements.
This component belongs to the CYW2073x family of wireless connectivity solutions from Infineon. It represents a consolidation of radio and processing capabilities into a single module format. The series targets applications demanding low latency and high energy efficiency in portable electronics. Related parts in the family may offer different memory sizes or package options.
Public confirmed substitute part numbers are not available in the provided source data. Consult Infineon's official obsolescence notices or cross-reference tools for potential alternatives if this specific variant is discontinued.
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