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DAC0808LCMX is listed in the Digital To Analog Converters range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC DAC 8BIT A-OUT 16SOIC. Review the specifications below when checking this part for your BOM.
The DAC0808LCMX is an 8-bit digital-to-analog converter manufactured by Texas Instruments. It features a parallel interface and delivers current output in an unbuffered configuration. The device operates within a supply voltage range of 4.5 V to 18 V for both analog and digital power rails. It achieves a sampling rate of 6.6 MS/s with a settling time of 100 ns. Integral nonlinearity is specified at +/- 0.5 LSB. Power consumption is rated at 33 mW. The component functions across a temperature range of 0°C to +70°C and is housed in a 16-SOIC package.
Verify the specific suffix against official datasheets to confirm pinout compatibility and electrical specifications. Ensure the source provides valid RoHS compliance documentation if required by the manufacturing process. Cross-reference the manufacturer part number with authorized distributor catalogs to validate authenticity and traceability before finalizing procurement orders.
Select this component when an 8-bit resolution and high-speed parallel interface are required. Verify that the system can accommodate the unbuffered current output topology. Confirm that the operating voltage range aligns with the available power supplies. Evaluate the thermal performance based on the specified power consumption and ambient temperature constraints.
This device belongs to the DAC0808 series of 8-bit D/A converters. It shares architectural similarities with other members like the DAC0800 and DAC0802 but offers specific performance characteristics regarding settling time and linearity. The family is designed for applications requiring moderate speed and resolution with simple digital interfacing.
Direct substitutes include the DAC0800LCMX/NOPB and DAC0802LCMX. Verify pin compatibility and electrical parameter alignment before substitution. Check for any differences in packaging or lead finish that might affect assembly processes.
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