SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The DC-ME4-01T-C is a System-on-Module (SOM) from the Digi Connect ME series, designed for embedded connectivity applications. It features an ARM7TDMI core processor operating at 55MHz. The module integrates 8MB of SDRAM and 4MB of Flash memory to support firmware and data storage requirements. Physical dimensions are specified as 36.7 mm x 21.7 mm x 19.1 mm. Connectivity is provided via an RJ45 interface. The component operates within a temperature range of -40°C to 85°C.
Verify current availability status as this part may be subject to end-of-life notifications or discontinuation notices from the manufacturer. Confirm that the specific memory configuration matches project requirements before procurement. Ensure compatibility with existing carrier boards or mounting solutions given the defined physical footprint. Review official documentation for any recent product change notifications affecting specifications or supply chain logistics.
Select this module when a complete, pre-certified Ethernet-enabled computing solution is required to reduce development time. Consider the ARM7TDMI architecture for legacy software compatibility or specific instruction set requirements. Evaluate the fixed memory sizes against application needs, noting that 8MB RAM and 4MB Flash are non-upgradeable on-module. Assess thermal management capabilities based on the specified operating temperature range for the intended deployment environment.
This component belongs to the Digi Connect ME family of modules, which focus on providing reliable wireless and wired connectivity for embedded systems. The series is known for integrating processing power with communication interfaces in a small form factor. This specific model emphasizes wired Ethernet connectivity over wireless options, targeting applications where stable network connections are critical for data transmission and remote management.
Check for direct substitutes within the Digi Connect ME lineup if this specific variant is unavailable. Verify that alternative modules maintain compatible pinouts and mechanical dimensions to ensure board-level interchangeability without redesigning the host PCB. Confirm that the replacement offers equivalent or superior performance metrics regarding processor speed and memory capacity.