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Product Detailed Parameters
- Description：IC REG BUCK 1.8V 650MA 6WLCSP
- Series：-
- Mfr：NXP USA Inc.
- Package：Tape & Reel (TR),Bulk
- Function：Step-Down
- Output Configuration：Positive
- Topology：Buck
- Output Type：Fixed
- Number of Outputs：1
- Voltage - Input (Min)：2.3V
- Voltage - Input (Max)：5.5V
- Voltage - Output (Min/Fixed)：1.8V
- Voltage - Output (Max)：-
- Current - Output：650mA
- Frequency - Switching：6MHz
- Synchronous Rectifier：Yes
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：6-XFBGA, WLCSP
- Supplier Device Package：6-WLCSP (1.36x0.96)
- Grade：-
- Qualification：-
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Overview
The DC6M603X6/18A,135 is a DC/DC switching converter manufactured by NXP. It functions as a buck regulator providing a fixed output voltage of 1.8V with a maximum current capacity of 650mA. The device is housed in a compact 6-wire leadless chip package (WLCSP) suitable for space-constrained designs. This component integrates power management capabilities within a small footprint to support efficient voltage regulation in portable and embedded electronic systems.
Feature Summary
- Integrates buck conversion functionality for step-down voltage regulation
- Provides fixed 1.8V output capability at up to 650mA load current
- Utilizes a compact WLCSP package design for minimal board space consumption
Applications
- Portable consumer electronics requiring regulated low-voltage rails
- Embedded systems utilizing NXP microcontrollers or processors
- IoT devices needing efficient point-of-load power management
Procurement Notes
Verify the specific suffix '135' against official NXP documentation to confirm tape-and-reel packaging specifications. Ensure the 1.8V output variant matches the system requirement, as other suffixes may indicate different voltage outputs. Cross-reference the part number with authorized distributors to confirm availability and authenticity before procurement.
Selection Notes
Select this component when a fixed 1.8V output is required without external feedback resistors. Consider the 650mA current limit for load requirements. The WLCSP package is ideal for applications prioritizing size reduction over high-power dissipation. Verify thermal performance constraints associated with the small form factor under full load conditions.
Part Context
This part belongs to NXP's portfolio of integrated power management solutions designed for mobile and industrial applications. It complements broader system designs by providing stable voltage regulation for logic cores and peripherals. The product line emphasizes efficiency and compactness, aligning with trends in miniaturized electronic hardware development.
Replacement Considerations
Consult NXP official substitution guides for direct replacements. Verify pin compatibility and electrical parameters such as output voltage and current rating. Ensure any substitute component meets the same package dimensions and thermal characteristics to maintain board layout integrity.
