Diode Arrays DD230S18KHPSA1 product image

DD230S18KHPSA1

  • Description:DIODE MOD GP 1800V 261A MOD
  • Series:-

SKU:b132e39b2cf7 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

DD230S18KHPSA1 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is DIODE MOD GP 1800V 261A MOD. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for DD230S18KHPSA1

  • Description:DIODE MOD GP 1800V 261A MOD
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bulk
  • Diode Configuration:1 Pair Series Connection
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):1800 V
  • Current - Average Rectified (Io) (per Diode):261A
  • Voltage - Forward (Vf) (Max) @ If:1.74 V @ 800 A
  • Speed:Standard Recovery >500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:160 mA @ 1800 V
  • Operating Temperature - Junction:150°C
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:Module
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for DD230S18KHPSA1

DD230S18KHPSA1

Diode Arrays Overview

The DD230S18KHPSA1 is a high-voltage silicon diode module manufactured by Infineon Technologies. It features a dual common-cathode configuration with one pair connected in series, providing a maximum repetitive peak reverse voltage of 1800 V and an average forward current of 261 A per diode. The device utilizes a chassis mount installation style within a module package. Key electrical characteristics include a standard recovery speed exceeding 500 ns and a maximum junction operating temperature of 125°C.

Diode Arrays Feature Summary

  • Dual common-cathode diode array configured for series connection
  • High blocking capability rated at 1800 V reverse voltage
  • Robust thermal management supporting operation up to 125°C junction temperature
  • Standard recovery speed suitable for general power applications

Diode Arrays Applications

  • Industrial motor drives and inverters
  • Uninterruptible power supply (UPS) systems
  • Solar photovoltaic string inverters
  • General purpose rectification in high-power converters

Diode Arrays Procurement Notes

Verify the specific suffix 'H' against official Infineon documentation to confirm pinout compatibility and mechanical dimensions before integration. Ensure that the chassis mounting interface matches the thermal management design requirements. Confirm that the standard recovery time aligns with the switching frequency constraints of the target application circuit to prevent excessive losses or failure.

Diode Arrays Selection Notes

Select this component when a high-voltage 1800 V rating and high-current capacity of 261 A are required in a single module form factor. The dual common-cathode topology simplifies bridge configurations compared to discrete solutions. Consider the standard recovery speed for applications where ultra-fast switching is not critical but robustness and high current handling are primary design drivers.

Diode Arrays Part Context

This part belongs to Infineon's broad portfolio of discrete and power modules, specifically under the diode array category. It represents a legacy product line often associated with International Rectifier technology acquired by Infineon. These modules are designed for industrial environments requiring reliable performance in demanding power conversion scenarios.

Diode Arrays Replacement Considerations

Direct replacement options should be sourced from official Infineon cross-reference lists. Verify that any substitute maintains identical voltage, current, and thermal specifications. Ensure mechanical footprint compatibility if space constraints are rigid. Generic equivalents may differ in recovery characteristics or thermal resistance.

DD230S18KHPSA1DD230S18KHPSA1

Click on the inquiry