DEA252450BT-2024C2

Overview

The TDK DEA252450BT-2024C2 is a surface-mount LTCC bandpass filter designed for RF signal conditioning. It operates with a center frequency of 2.44 GHz and provides an 80 MHz bandwidth. The component features a 50 Ohm impedance and exhibits a typical insertion loss of 2.25 dB. It is housed in a compact 1008 (2520 metric) package, suitable for automated SMD/SMT assembly. The device supports commercial grade applications and functions reliably within an operating temperature range of -40°C to +85°C.

Feature Summary

• Utilizes Low Temperature Co-fired Ceramic (LTCC) technology for low insertion loss and stable performance
• Provides precise RF filtering with a defined 80 MHz bandwidth around the 2.44 GHz center frequency
• Designed for high-volume surface mount manufacturing using standard 1008 footprints

Applications

• Wireless LAN modules requiring 2.4 GHz band filtering
• Bluetooth communication devices
• RF front-end signal conditioning circuits

Procurement Notes

Verify the specific suffix C2 against official TDK documentation to confirm the 80 MHz bandwidth specification, as suffix variations often denote distinct electrical parameters. Ensure compatibility with existing PCB land patterns for the 1008 package. Confirm that the commercial grade rating meets the environmental requirements of the target application before finalizing procurement.

Selection Notes

Select this component when a narrow 80 MHz passband is required at 2.44 GHz. The 1008 package offers a balance between size and thermal handling for commercial electronics. Compare insertion loss specifications against system link budget requirements. Ensure the 50 Ohm impedance matches the source and load impedances in the RF chain to minimize reflection losses.

Part Context

This part belongs to the TDK DEA series of multilayer bandpass filters. These components are engineered for RF applications where size constraints and signal integrity are critical. The DEA series leverages LTCC processes to integrate passive elements into a single robust structure, commonly used in mobile and wireless infrastructure.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify pinout and footprint compatibility if considering alternative manufacturers. Check datasheet specifications for matching center frequency and bandwidth before attempting substitution.