DG308BDQ-T1-E3

DG308BDQ-T1-E3

$1.07
  • Description:IC SW SPST-NOX4 85OHM 16TSSOP
  • Series:-

SKU:1f95c2b5f71b Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SW SPST-NOX4 85OHM 16TSSOP
  • Series:-
  • Mfr:Vishay Siliconix
  • Package:Tape & Reel (TR)
  • Switch Circuit:SPST - NO
  • Multiplexer/Demultiplexer Circuit:1:01
  • On-State Resistance (Max):85Ohm
  • Channel-to-Channel Matching (ΔRon):1.7Ohm
  • Voltage - Supply, Single (V+):4V ~ 44V
  • Voltage - Supply, Dual (V±):±4V ~ 22V
  • Switch Time (Ton, Toff) (Max):200ns, 150ns
  • -3db Bandwidth:-
  • Charge Injection:1pC
  • Channel Capacitance (CS(off), CD(off)):5pF, 5pF
  • Current - Leakage (IS(off)) (Max):500pA
  • Crosstalk:-95dB @ 100kHz
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package:16-TSSOP
  • Number of Circuits:4

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DG308BDQ-T1-E3

Overview

The DG308BDQ-T1-E3 is a quad single-pole single-throw (SPST) analog switch manufactured by Vishay Siliconix in a 16-pin Thin Shrink Small Outline Package (TSSOP). It operates on dual supplies ranging from ±4 V to ±22 V or a single supply up to 44 V. The device features a maximum drain-source on-resistance of 85 Ω at room temperature and 100 Ω across the full industrial temperature range (-40 °C to +85 °C). Key electrical specifications include a turn-on time of 200 ns, a turn-off time of 150 ns, and an off-isolation of 90 dB at 100 kHz.

Feature Summary

  • CMOS compatible logic interface for simple integration
  • Extended analog signal handling capability up to ±22 V
  • Low charge injection design minimizes switching transients

Applications

  • Industrial instrumentation
  • Test equipment
  • Sample-and-hold circuits

Procurement Notes

Verify the specific suffix against official documentation to confirm package type and environmental rating. Confirm RoHS compliance status as required by project specifications. Ensure the ordering code matches the exact pin configuration and lead finish requirements for the target PCB assembly process.

Selection Notes

Select this component when high voltage tolerance and low leakage are prioritized over ultra-low on-resistance. Verify that the TSSOP-16 footprint aligns with available board space. Consider thermal derating guidelines if operating near the upper limits of the specified power dissipation envelope.

Part Context

This part belongs to the DG308B series, representing an improved version of the industry-standard DG308A. It utilizes a proprietary silicon gate CMOS process to achieve lower on-resistance and higher speed compared to legacy variants while maintaining true bi-directional performance.

Replacement Considerations

DG308BDJ: Identical functional specifications utilizing a 16-pin Plastic DIP package instead of surface mount TSSOP.

DG308BDQ-T1-E3DG308BDQ-T1-E3
$1.07
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