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DG413HSDY-T1-E3 is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Vishay Siliconix. Its product description is IC SW SPST-NO/NCX4 35OHM 16SOIC. Review the specifications below when checking this part for your BOM.
The DG413HSDY-T1-E3 is a precision monolithic quad SPST CMOS analog switch manufactured by Vishay Siliconix. It features a maximum supply voltage of 44 V and supports an analog signal range of ±15 V. The device has a maximum on-resistance (RDS(on)) of 35 Ω at room temperature and ±15 V supplies. Turn-on time is typically 68 ns with a maximum of 105 ns, while turn-off time is typically 42 ns with a maximum of 80 ns. Power dissipation in the SOIC-16 package is rated at 600 mW. Supply current is ultra-low, typically 0.0001 µA. It operates within a temperature range of -40 °C to +85 °C.
Verify the specific suffix T1-E3 corresponds to the tape-and-reel packaging format required for automated assembly processes. Confirm that the D suffix indicates the extended industrial temperature range of -40 °C to +85 °C matches the operational environment requirements. Ensure compliance with RoHS directives as indicated by the E3 suffix before finalizing procurement specifications.
Select this component when high-speed switching and low power consumption are critical design constraints. The DG413HS variant provides mixed normally open and normally closed channels, differing from the all-normally-open configuration of the DG411HS. Verify that the 35 Ω on-resistance meets the signal integrity requirements for the specific analog application under consideration.
This part belongs to the DG411HS/DG412HS/DG413HS family of precision analog switches built on a high-voltage silicon gate process. The DG413HS specifically integrates two normally open and two normally closed switches within the same 16-pin package architecture. This family is designed to offer wide dynamic range and low signal distortion for precision analog signal routing tasks.
DG413HSDY-E3 (Tube packaging)
The break-before-make time delay (tD) is typically 20 ns at room temperature with ±15 V supplies.
The DG413HS contains two normally open and two normally closed switches, whereas the DG411HS consists entirely of normally open switches controlled by the same logic levels.
The maximum power dissipation for the 16-Pin Narrow SOIC package is 600 mW.
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