— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MUX 16:1 300OHM 28TSSOP
- Series:-
- Mfr:Vishay Siliconix
- Package:Tape & Reel (TR)
- Switch Circuit:-
- Multiplexer/Demultiplexer Circuit:16:01
- On-State Resistance (Max):300Ohm
- Channel-to-Channel Matching (ΔRon):10Ohm
- Voltage - Supply, Single (V+):12V ~ 44V
- Voltage - Supply, Dual (V±):±5V ~ 20V
- Switch Time (Ton, Toff) (Max):250ns, 200ns
- -3db Bandwidth:114MHz
- Charge Injection:1pC
- Channel Capacitance (CS(off), CD(off)):3pF, 13pF
- Current - Leakage (IS(off)) (Max):1nA
- Crosstalk:-85dB @ 1MHz
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:28-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package:28-TSSOP
- Number of Circuits:1
- Grade:-
- Qualification:-
Download product information
Overview
The DG506BEQ-T1-GE3 is a precision 16-channel single-ended CMOS analog multiplexer manufactured by Vishay Siliconix. It connects one of sixteen inputs to a common output using a 4-bit binary address (A0-A3). The device operates with single or dual power supplies, supporting voltage ranges from ±5 V to ±20 V or up to 44 V absolute maximum rating. Key electrical parameters include a maximum on-resistance of 300 Ω at room temperature and 400 Ω across the full temperature range (-40 °C to +125 °C). It features ultra-low charge injection of 1 pC, low leakage current of 1 nA, and an off-isolation of -85 dB at 1 MHz. The component utilizes break-before-make switching to prevent crosstalk and includes an enable function for stacking multiple devices.
Feature Summary
- Ultra-low switch charge injection and low channel capacitance ensure superior switching performance and reduced glitching.
- Break-before-make switching action protects against momentary crosstalk between adjacent channels during state transitions.
- TTL-compatible control inputs allow direct interfacing with standard logic families over the full operating temperature range.
- Extended supply voltage capability up to 44 V provides flexibility for diverse system power architectures.
Applications
- High-speed and high-precision data acquisition systems
- Audio and video signal routing and switching
- Automated Test Equipment (ATE) systems
- Medical instrumentation
Procurement Notes
Verify the specific package suffix 'EQ' corresponds to the 28-lead TSSOP format required for your PCB layout. Confirm that the 'GE3' suffix indicates compliance with current RoHS standards before finalizing orders. Ensure the ordering quantity aligns with the manufacturer's standard reel packaging specifications to avoid handling discrepancies.
Selection Notes
Select this component when a single-ended 16:1 multiplexing configuration is required rather than the differential 8:1 dual configuration offered by the DG507B variant. Consider the 28-lead TSSOP package dimensions if space constraints preclude the use of SOIC or PLCC packages. Verify that the 300 Ω on-resistance meets the signal integrity requirements of your specific application circuit.
Part Context
This part belongs to the DG506B/DG507B series, which are fabricated on an enhanced SG-II CMOS process. This technology reduces charge injection, lowers device leakage, and minimizes parasitic capacitance compared to previous generations. The series serves as a superior alternative to legacy parts such as the ADG506A and HI-506, offering improved ruggedness and wider supply ranges.
Replacement Considerations
Publicly confirmed substitutes listed in official documentation include the ADG506A, DG506A, and HI-506. Note that these are legacy counterparts; verify pin compatibility and parameter differences before implementation.
FAQ
What is the difference between the DG506B and DG507B?
The DG506B is a 16-channel single-ended analog multiplexer, whereas the DG507B is a dual 8-channel differential analog multiplexer.
How does the Enable (EN) pin function?
The Enable function allows the user to reset the multiplexer to all switches off, which facilitates the stacking of several devices in a system.
What is the purpose of the break-before-make switching action?
It prevents momentary crosstalk between adjacent channels by ensuring the old connection is broken before the new one is made.
ChipApex | Global Electronic Components Supplier









