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DG507AC/D
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Product Detailed Parameters
- Description：IC MUX DUAL 8:1 400OHM DIE
- Series：-
- Mfr：Analog Devices Inc./Maxim Integrated
- Package：Tray
- Switch Circuit：-
- Multiplexer/Demultiplexer Circuit：8:01
- On-State Resistance (Max)：400Ohm
- Channel-to-Channel Matching (ΔRon)：27Ohm
- Voltage - Supply, Single (V+)：4.5V ~ 18V
- Voltage - Supply, Dual (V±)：±4.5V ~ 18V
- Switch Time (Ton, Toff) (Max)：1µs, 400ns (Typ)
- -3db Bandwidth：-
- Charge Injection：-
- Channel Capacitance (CS(off), CD(off))：6pF, 23pF
- Current - Leakage (IS(off)) (Max)：5nA
- Crosstalk：-
- Operating Temperature：0°C ~ 70°C (TA)
- Mounting Type：Surface Mount
- Package / Case：Die
- Supplier Device Package：Die
- Number of Circuits：2
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Overview
The DG507AC/D is a dual 8:1 analog multiplexer manufactured by Analog Devices Inc. under the Maxim Integrated brand. It features two independent multiplexer circuits, each selecting one of eight input channels. The device operates with a single supply voltage ranging from 10.8V to 16.5V or dual supplies of ±10.8V to ±16.5V. Key electrical parameters include a maximum on-resistance of 300 ohms and a channel-to-channel on-resistance matching of 15 ohms. Switching times are specified at a maximum of 300ns for both turn-on and turn-off. The component is housed in a Die package and is designed for surface mount installation.
Feature Summary
- Dual independent 8:1 multiplexing architecture
- TTL and CMOS logic compatibility
- Low charge injection characteristics
Applications
- Data acquisition systems
- Industrial process control
- Instrumentation signal routing
Procurement Notes
Verify the specific die revision and wafer lot details when sourcing this component, as it is supplied as a bare die. Confirm that the handling equipment supports the required surface mount installation method for die attach. Ensure the design accounts for the specific thermal and mechanical constraints associated with bare die packaging rather than standard plastic or ceramic packages.
Selection Notes
Select the DG507AC/D when a design requires two separate 8-channel switching paths within a compact form factor. Compare its 300-ohm on-resistance against system requirements for signal integrity. Consider the die package format if space constraints preclude the use of larger PLCC or DIP packages. Verify that the operating temperature range meets the application's environmental conditions.
Part Context
This part belongs to the DG507A series of analog multiplexers. It is functionally related to other devices in the DG506 and ADG507 families, which offer similar multiplexing capabilities but may differ in package types or specific electrical tolerances. The 'D' suffix typically denotes the die configuration within the manufacturer's product line.
Replacement Considerations
The ADG507AKPZ is a documented alternative offering identical functional specifications in a 28-PLCC package. Designers must account for the significant difference in physical footprint and mounting technology between the bare die DG507AC/D and the leaded PLCC package of the ADG507AKPZ.
