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DHG50X1200NA is listed in the Diode Arrays range at ChipApex. The manufacturer field lists IXYS. Its product description is DIODE MOD GP 1200V 25A SOT227B. Review the specifications below when checking this part for your BOM.
The DHG50X1200NA is a high-performance fast recovery diode manufactured by IXYS. It features a single configuration with a maximum repetitive peak reverse voltage of 1200 V and a continuous forward current rating of 50 A. The device utilizes SONIC-FRD technology to achieve low loss and soft recovery characteristics, minimizing switching noise and electromagnetic interference. Key electrical parameters include a maximum forward voltage of 2.6 V at rated current and a typical reverse recovery time of 35 ns. It operates within a junction temperature range of -40°C to +150°C and is housed in a SOT-227-4 screw-mount package.
Verify the specific suffix and revision level against the manufacturer's latest datasheet before procurement, as component specifications may evolve. Confirm that the sourcing channel provides authentic IXYS products with traceable documentation. Ensure the supplier can provide necessary compliance certificates, such as RoHS status, if required for your assembly process. Check for any end-of-life notifications or obsolescence warnings associated with this part number.
Select this component when designing circuits requiring fast switching speeds with reduced reverse recovery charge. The 1200 V rating suits medium-voltage applications, while the 50 A current capacity supports moderate power levels. Consider the SOT-227-4 package for its thermal performance and mounting simplicity in industrial environments. Evaluate the soft recovery profile to ensure compatibility with sensitive gate-drive circuits in high-frequency topologies.
This diode belongs to IXYS' SONIC-FRD series, designed for efficiency in hard-switching applications. The family emphasizes reduced switching losses compared to standard fast recovery diodes. It serves as a discrete alternative to integrated modules in cost-sensitive designs where individual component control over thermal management is preferred.
Publicly confirmed substitute part numbers are not available in the provided source material.
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