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DHVSD3004SSQ-7 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Diodes Incorporated. Its product description is DIODE ARR GP 300V 225MA SOT23-3. Review the specifications below when checking this part for your BOM.
The DHVSD3004SSQ-7 is a high-voltage switching diode manufactured by Diodes Incorporated. It belongs to the DHVSD series and is housed in an SOT-23 surface-mount package. The component is designed for applications requiring breakdown voltages exceeding 100V. It features fast switching characteristics suitable for general-purpose signal processing and protection circuits. The device complies with RoHS standards and is automotive qualified under AEC-Q101 specifications, ensuring reliability in demanding environments.
Verify the specific suffix 'Q' indicates AEC-Q101 automotive qualification when sourcing. Confirm the package type matches the design requirements as variations exist within the series. Ensure the supplier provides official datasheets confirming the electrical parameters for this specific part number before integration into production designs.
Select this component when designing circuits that require robust high-voltage handling in compact surface-mount formats. The automotive qualification makes it suitable for vehicle electronics where long-term reliability is critical. Compare its switching speed and leakage current against standard industrial diodes if operating conditions exceed typical automotive ranges.
This part is part of Diodes Incorporated's high-voltage switching diode portfolio. It shares functional similarities with other members of the DHVSD family but is distinguished by its specific packaging and automotive-grade certification. It serves as a specialized solution for replacing larger through-hole components in modern miniaturized electronic assemblies.
Check for direct substitutes within the same manufacturer's lineup that share identical pinouts and electrical ratings. Verify that any alternative component meets the same AEC-Q101 requirements if used in automotive applications. Ensure thermal and mechanical compatibility with existing PCB footprints.
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