DIP1524-01D3

RF Multiplexers Overview

The DIP1524-01D3 is an RF diplexer manufactured by STMicroelectronics, designed for signal conditioning in GPS and GLONASS applications. It operates within the low frequency band of 1573.42MHz to 1605.89MHz and the high frequency band of 2.4GHz to 2.7GHz. The component provides an attenuation of 18.00dB at the lower band. It utilizes IPD technology on a non-conductive glass substrate to optimize RF performance. The device is available in compact chip-scale packages including 4-UFBGA and FCBGA configurations.

RF Multiplexers Feature Summary

• Separates RF received signals between GPS/GLONASS bands and 2.4GHz ISM bands
• Utilizes IPD technology on non-conductive glass substrate for optimized RF performance
• Provides specific attenuation characteristics for low-frequency band separation

RF Multiplexers Applications

• GPS receiver front-end signal conditioning
• GLONASS receiver signal filtering
• Dual-band wireless communication systems requiring isolation between navigation and data bands

RF Multiplexers Procurement Notes

Verify the specific package variant (UFBGA or FCBGA) required for your PCB layout, as the part number may correspond to different physical footprints. Confirm that the operating temperature range meets your environmental specifications. Ensure that the 18dB attenuation value aligns with your system's interference rejection requirements. Cross-reference the datasheet revision date to ensure compatibility with current manufacturing standards.

RF Multiplexers Selection Notes

Select this component when simultaneous operation of GPS/GLONASS receivers and 2.4GHz transceivers is required in close proximity. The choice depends on the need for compact integration using chip-scale packaging options. Consider the substrate technology benefits for high-frequency performance stability. Evaluate the specific attenuation profile against system noise floor requirements.

RF Multiplexers Part Context

This diplexer belongs to STMicroelectronics' portfolio of passive components utilizing integrated passive device (IPD) technology. These components are engineered for miniaturization and high reliability in mobile and IoT devices. The use of glass substrates distinguishes these parts from traditional ceramic-based alternatives, offering improved thermal and electrical characteristics for modern RF designs.

RF Multiplexers Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Direct replacement requires matching the exact frequency bands, attenuation values, and package dimensions. Consult STMicroelectronics technical support for equivalent product recommendations if this specific model is unavailable.