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DLP0NSN350HL2L is listed in the Common Mode Chokes range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is CMC 100MA 2LN 35 OHM SMD. Review the specifications below when checking this part for your BOM.
The Murata Electronics DLP0NSN350HL2L is a surface-mount common mode choke filter designed for signal line noise suppression. It features an impedance of 35 ohms at a test frequency of 100 MHz with a tolerance of 20%. The component supports a maximum DC current of 100 mA and has a maximum DC resistance of unspecified low value typical for this class. It operates within a temperature range of -40°C to +85°C and utilizes a compact 0302 (0805 metric) package footprint.
Verify component authenticity through authorized Murata distributors due to potential counterfeit risks. Confirm RoHS compliance status via official datasheets before integration. Check for end-of-life status as availability may be limited. Ensure storage conditions adhere to manufacturer guidelines to maintain solderability and electrical characteristics during assembly.
Select this component when a 35-ohm impedance at 100 MHz is required for specific signal lines. Verify that the 100 mA current rating meets the operational requirements of the target circuit. Consider the 0302 package size for space-constrained layouts. Compare against alternative impedances if noise profiles differ significantly from design specifications.
This part belongs to the DLP0N series of common mode chokes manufactured by Murata Electronics. These components are engineered for suppressing electromagnetic interference in compact electronic devices. The series typically employs thin-film construction techniques to achieve consistent electrical performance across varying environmental conditions while maintaining a small physical profile suitable for modern surface-mount applications.
Consult Murata's official documentation for suggested alternates such as the DLM0NSM900HY2D or similar series members. Verify impedance, current rating, and package dimensions match before substitution. Cross-reference datasheets to ensure compatibility with existing board layouts and thermal management strategies.
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