DLP670SFYR

Specialized ICS Overview

The DLP670SFYR is a digital micromirror device (DMD) featuring a 2716 × 1600 array with over 4.3 million mirrors and a 5.4-micron pitch. It utilizes four 16-bit LVDS double data rate input buses for high-speed pattern display. The component operates within an array temperature range of 0°C to 90°C and supports broadband visible light from 420 nm to 700 nm. Designed for bottom illumination, it integrates driver circuitry and is intended for use with dual DLPC900 controllers.

Specialized ICS Feature Summary

• High-resolution 2716 × 1600 micromirror array with 5.4-micron pitch
• Four 16-bit LVDS double data rate input-data buses
• Designed for bottom illumination with ±17.5° tilt angle
• Integrated micromirror driver circuitry

Specialized ICS Applications

• Industrial 3D scanners for machine vision
• Medical ophthalmology and hyperspectral imaging
• 3D touchless metrology and quality control

Specialized ICS Procurement Notes

Verify the FYR package designation corresponds to the 350-pin CPGA form factor. Confirm compatibility with the DLPC900 chipset for reliable operation. Ensure strict adherence to ESD handling protocols due to sensitivity. Validate power supply sequencing for VBIAS, VCC, VCCI, VOFFSET, and VRESET. Check storage conditions regarding dew point limits.

Specialized ICS Selection Notes

Select this component for applications requiring high-resolution spatial light modulation at fast pattern rates. Ensure the system design accommodates the specific thermal management requirements for the 0°C to 90°C operational range. Verify that the optical path supports bottom illumination geometry. Confirm interface compatibility with four LVDS data buses and associated clock signals.

Specialized ICS Part Context

The DLP670SFYR belongs to the DLP670S series of digital micromirror devices. It functions as a MEMS-based spatial light modulator designed to work in conjunction with Texas Instruments DLP chipset components. The FYR suffix indicates the specific 350-pin ceramic package configuration used for board integration.

Specialized ICS Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation.