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DLPC230STZDQQ1 is listed in the Specialized ICS range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC DIG MICROMIRROR DEV 324BGA. Review the specifications below when checking this part for your BOM.
The DLPC230STZDQQ1 is an automotive-grade Digital Micromirror Device (DMD) controller from Texas Instruments, designed for functional safety applications up to ASIL-B. It supports DLP553xS-Q1 and DLP462xS-Q1 chipsets, integrating an ARM Cortex-R4F processor with ECC and on-chip SRAM to eliminate external memory requirements. The device features a 600MHz SubLVDS interface for low-power DMD control and video processing capabilities including scaling and bezel adjustment. It operates within a temperature range of -40°C to +105°C and is housed in a 324-pin BGA package.
Verify the specific ordering suffix against the manufacturer's current datasheet to confirm package type and qualification status. Ensure compatibility with the intended DMD component, such as the DLP5530S-Q1 or DLP4620S-Q1, as the controller is part of a specific chipset architecture requiring coordinated system management.
Select this controller for automotive interior display systems requiring functional safety certification. It is suitable for designs utilizing DLP553xS-Q1 or DLP462xS-Q1 DMDs. Consider the integrated SRAM and video processing features if external memory constraints are a concern. Ensure the system design accommodates the required power sequencing and interfaces with the TPS99000S-Q1 controller for optimal performance.
This component belongs to the DLPC23xS-Q1 family of automotive DMD controllers. It is specifically engineered to work in conjunction with the TPS99000S-Q1 system management and illumination controller. The DLPC230S-Q1 variant utilizes a ZDQ 324-pin BGA package, distinguishing it from other family members like the DLPC231S-Q1 which uses a ZEK package.
The DLPC231S-Q1 is a related controller within the same family but differs in physical package dimensions (15mm x 15mm vs 23mm x 23mm). Direct pin-to-pin replacement is not possible due to the different footprint and ball mapping. System redesign is required if substituting between these variants.
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