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DLPC230TZDQQ1 is listed in the Specialized ICS range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC DIG MICROMIRROR DEV 324BGA. Review the specifications below when checking this part for your BOM.
The DLPC230TZDQQ1 is an automotive-grade Digital Micromirror Device (DMD) controller designed for Texas Instruments DLP technology. Qualified to AEC-Q100 standards, it operates within a temperature range of –40°C to 105°C and features HBM ESD Level 2 and CDM Level C4B ratings. The device supports the DLP553x-Q1 and DLP462x-Q1 chipsets, integrating an ARM Cortex-R4F processor with SECDED ECC. It includes internal SRAM to eliminate external memory requirements and provides a 600MHz SubLVDS interface for low-power DMD control. Video processing capabilities include image scaling, bezel adjustment, and gamma correction.
Verify the specific suffix 'ZDQ' corresponds to the 324-BGA package configuration required for the design. Confirm that the component meets the necessary AEC-Q100 qualification levels for the target automotive environment. Ensure compatibility with the associated DMD and system management controllers in the chipset architecture.
Select this controller for designs requiring integration with DLP553x-Q1 or DLP462x-Q1 chipsets. The internal SRAM simplifies board layout by removing the need for external DRAM. Consider the 324-BGA package dimensions when planning PCB space and thermal management solutions for the automotive application.
This component belongs to the DLPC23x-Q1 family of automotive DMD controllers. It functions as the central processing unit for DLP-based projection systems in vehicles. The device works in conjunction with the TPS99000-Q1 system management controller to manage power sequencing, illumination, and display timing for high-dynamic-range applications.
The DLPC231-Q1 is a pin-compatible alternative within the same family, featuring a smaller 15mm x 15mm BGA package instead of the 23mm x 23mm package found in the DLPC230-Q1.
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