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DM74ALS1000AN is listed in the Inverter Gates range at ChipApex. The manufacturer field lists onsemi. Its product description is IC GATE NAND 4CH 2-INP 14MDIP. Review the specifications below when checking this part for your BOM.
The DM74ALS1000AN is a quadruple 2-input NAND buffer manufactured by onsemi, utilizing an advanced oxide-isolated, ion-implanted Schottky TTL process. It operates within a supply voltage range of 4.5V to 5.5V and supports a free air operating temperature from 0°C to +70°C. The device features single-ended inputs and outputs with non-inverting logic polarity. Electrical characteristics include a maximum propagation delay of 28ns for low-to-high transitions and 27ns for high-to-low transitions under specified load conditions.
Verify the specific package configuration matches the required footprint, as this part number denotes the 14-lead Plastic Dual-In-Line Package (PDIP). Confirm that the manufacturer documentation aligns with current product availability, noting that historical datasheets may reference Fairchild Semiconductor prior to corporate restructuring. Ensure compliance with RoHS directives if applicable to the target assembly environment.
Select this component when a quad 2-input NAND gate is required in a through-hole DIP package. Compare against the SOIC variant (DM74ALS1000AM) if surface mount technology is preferred. Verify that the 27ns/28ns propagation delays meet system timing requirements. Ensure the 4.5V to 5.5V supply voltage range is compatible with the existing power distribution network.
This device belongs to the DM74ALS series, representing Advanced Low-power Schottky logic family components. It serves as a buffer/driver version of the standard DM74ALS00A NAND gate. The series is characterized by improved line receiving characteristics and reduced power consumption compared to standard TTL counterparts, suitable for general-purpose digital applications.
The DM74ALS1000AM is a direct functional equivalent available in a 14-Lead Small Outline Integrated Circuit (SOIC) package. Both devices share identical electrical specifications and logic functions, differing only in physical packaging and mounting style.
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