DMG563H50R

Overview

The DMG563H50R is a digital transistor manufactured by Panasonic Industry, featuring an integrated dual configuration with NPN and PNP transistors. It is housed in the SMini5-F3-B surface-mount package, measuring 2.0x2.1mm. The component includes built-in bias resistors with a typical value of 10 kOhms. Key electrical ratings include a maximum collector-emitter voltage (VCEO) of -50 V and a continuous collector current of -100 mA. Designed for high-temperature environments, it supports a maximum operating temperature of +150 C.

Feature Summary

• Dual configuration integrating both NPN and PNP transistors within a single compact footprint
• Integrated bias resistors simplify circuit design by reducing external component count
• High thermal stability rated for operation up to +150 C

Applications

• Signal switching circuits requiring complementary logic levels
• Driver stages for low-power loads in consumer electronics
• Interface circuits between microcontrollers and peripheral devices

Procurement Notes

Verify availability status as this component may be discontinued or subject to limited supply. Confirm RoHS compliance details through official datasheets before integration. Check for product change notifications regarding manufacturing updates or specification revisions.

Selection Notes

Select this component when space constraints require a dual-transistor solution in an SMini5 package. Ensure the 10 kOhm internal resistor aligns with the driving source impedance. Verify that the -50 V rating meets the circuit's voltage requirements.

Part Context

This part belongs to Panasonic's digital transistor series, designed for compact signal processing applications. The SMini5 package offers a small form factor suitable for dense PCB layouts. It serves as a replacement for discrete transistor pairs in logic interface designs.

Replacement Considerations

Check Panasonic's official substitution guide for equivalent parts with identical pinouts and electrical characteristics. Verify package compatibility and thermal performance before swapping components.