DPC357S-X-TR

Overview

The DPC357S-X-TR is a photodiode output optocoupler manufactured by Diodes Incorporated. It features an infrared emitting diode coupled to a high-speed photodiode detector within a compact SOP-4 surface-mount package. The device provides electrical isolation with a rated insulation voltage of 3.75 kVrms. Key electrical parameters include a collector-emitter voltage of 5 V and a current transfer ratio (CTR) ranging from 100% to 200% at a forward current of 5 mA. The component is supplied in tape and reel packaging, typically containing 3000 units per reel, suitable for automated assembly processes.

Feature Summary

• High-speed signal transmission capability via integrated photodiode detection
• Compact SOP-4 surface-mount form factor for space-constrained designs
• Robust galvanic isolation barrier rated at 3.75 kVrms

Applications

• Digital communication interfaces requiring signal isolation
• Microcontroller input/output isolation circuits
• Industrial control systems with noise-sensitive data lines

Procurement Notes

Verify the specific suffix designation against official Diodes Incorporated documentation to confirm exact performance characteristics and compliance status. Ensure that the ordering information matches the required packaging format and regulatory certifications prior to procurement. Cross-reference the manufacturer part number with authorized distributor catalogs to validate authenticity and availability status.

Selection Notes

Select this component when high-speed digital isolation is required within a small footprint. The photodiode output architecture offers faster response times compared to standard phototransistor alternatives. Consider the 5 V collector-emitter voltage limit and the specific CTR range when designing the receiving circuitry interface. Evaluate the SOP-4 package dimensions against the target PCB layout constraints.

Part Context

This device belongs to the DPC357S series of photodiode output optocouplers from Diodes Incorporated. The series is designed for applications demanding rapid signal transfer between isolated circuits. The X-TR suffix indicates the specific binning or variant configuration along with the tape-and-reel packaging method used for mass production.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Verify compatibility with alternative components by comparing pin configurations, isolation voltages, and speed specifications against the original design requirements.