SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
DPF60C200HB is listed in the Diode Arrays range at ChipApex. The manufacturer field lists IXYS. Its product description is DIODE ARRAY GP 200V 60A TO-247AD. Review the specifications below when checking this part for your BOM.
The DPF60C200HB is a HiPerFRED²™ series switching diode manufactured by IXYS. It features a dual common cathode configuration housed in a TO-247-3 through-hole package. Key electrical parameters include a peak reverse voltage of 200 V, an average forward current of 30 A per diode, and a maximum surge current of 560 A. The device exhibits a typical reverse recovery time of 55 ns and a forward voltage of 1.45 V at 30 A. Power dissipation is rated at 215 W, with an operating junction temperature range from -55°C to +150°C.
Verify the specific suffix HB against official IXYS documentation to confirm pinout and thermal characteristics. Ensure the procurement channel provides valid manufacturer traceability. Confirm RoHS compliance status via the latest datasheet revision. Check for any recent product change notices that may affect mechanical dimensions or electrical ratings before finalizing orders.
Select this component when a dual common cathode arrangement is required for synchronous rectification or bridgeless PFC topologies. The 200 V rating suits low-voltage high-current applications. Compare the 55 ns recovery time against system switching frequencies to ensure adequate margin. Evaluate the TO-247-3 package suitability for the available PCB real estate and heatsinking constraints.
This part belongs to the IXYS HiPerFRED²™ family, designed for high-efficiency switching applications. It serves as a specialized alternative to standard rectifiers where faster recovery is critical. The dual configuration simplifies circuit design by integrating two matched diodes into one thermal module, reducing board space compared to discrete solutions.
Direct substitutes within the same series include DPF60C200HJ, which shares similar electrical characteristics but may differ in packaging details or specific test conditions. Verify compatibility with existing footprints and thermal management designs before substitution.
Explore related parts through Rectifiers, Diodes, Discrete Semiconductor Products, all product categories.