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DPX167125DT-8197B1 is listed in the RF Multiplexers range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is 2.4-2.5GHz W-LAN&BT/5-7GHz W-LAN. Review the specifications below when checking this part for your BOM.
The DPX167125DT-8197B1 is a multilayer RF diplexer manufactured by TDK Corporation, designed for band-switching in dual-band communication systems. It operates across two primary frequency ranges: 617MHz to 2.4GHz and 2.5GHz to 2.69GHz for the lower band, and 5.15GHz to 5.925GHz alongside 5.925GHz to 7.125GHz for the upper band. The component supports applications including 2.4-2.5GHz WLAN and Bluetooth, as well as 5-7GHz WLAN. It features low insertion loss and high attenuation characteristics, ensuring efficient signal separation. The device is housed in a compact 0603 (1608 Metric) surface-mount package with six PCB pads, measuring 1.60mm x 0.80mm x 0.60mm. It functions within an operating temperature range of -40°C to 85°C and complies with RoHS3 standards.
Verify the specific part number suffix against official TDK documentation to ensure correct frequency band configuration. Confirm that the 0603 footprint matches the target PCB layout. Check for RoHS3 compliance requirements if applicable to the end product. Ensure storage conditions account for the specified moisture sensitivity level. Validate that the operating temperature range meets the environmental demands of the final application.
Select this component when designing dual-band transceivers requiring integrated filtering for 2.4GHz and 5GHz ISM bands. The small 067125DT form factor is suitable for space-constrained mobile devices. Consider the attenuation specifications to ensure adequate isolation between transmit and receive paths. Verify compatibility with standard SMT reflow processes given the ceramic construction. Evaluate system-level insertion loss impacts on overall link budget performance.
This diplexer belongs to TDK's DPX series of multilayer RF components. These devices are engineered for high-reliability wireless communications where size reduction is critical. The series utilizes advanced ceramic materials to achieve stable performance across wide frequency spans. Integration of multiple filters into one package reduces board area and simplifies assembly compared to discrete solutions.
Public confirmed substitute part numbers are not available in the provided documentation.
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