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The DS1302ZN+ is an industrial-grade real-time clock and calendar IC manufactured by Analog Devices Inc./Maxim Integrated. It provides seconds, minutes, hours, date, month, day of week, and year information with leap-year compensation valid up to the year 2100. The device features a simple 3-wire serial interface compatible with most microcontrollers and includes 31 bytes of battery-backed static RAM for general-purpose data storage. Operating on a supply voltage range of 2V to 5.5V, it consumes less than 300nA at 2.0V. The component is housed in an 8-SOIC package (150 mils width) and supports operation across a temperature range of -40°C to +85°C.
Verify that the specific order suffix 'ZN' corresponds to the industrial temperature grade (-40°C to +85°C) and the 150-mil SOIC package width. Confirm RoHS compliance status if required by local regulations. Ensure the supplier provides the official Maxim Integrated datasheet for accurate timing parameters and electrical characteristics during integration.
Select the DS1302ZN+ when an industrial temperature range is required compared to the commercial variant (DS1302Z+). This model utilizes an 8-pin SOIC package with a 150-mil body width, suitable for surface-mount applications with space constraints. Ensure the design accommodates the 3-wire synchronous serial interface requirements and external 32.768kHz crystal connection.
The DS1302ZN+ belongs to the DS1302 family of trickle-charge timekeeping chips produced by Maxim Integrated, now part of Analog Devices. It serves as a successor to earlier models like the DS1202, offering enhanced features such as dual power pins for primary and backup supplies and additional scratchpad memory. The 'N' suffix denotes the industrial temperature rating, while 'Z' indicates the specific SOIC package style.
The DS1302SN+ is a direct replacement offering the same industrial temperature range (-40°C to +85°C) but in a wider 208-mil SOIC package. For commercial temperature applications (0°C to +70°C), the DS1302Z+ is available in the same 150-mil SOIC footprint. DIP packages are also available as alternatives if through-hole mounting is preferred.