DS15BR400TVS

Overview

The DS15BR400TVS is a four-channel Low Voltage Differential Signaling (LVDS) buffer and repeater manufactured by National Semiconductor. It supports data rates up to 2 Gb/s with an input voltage range of -100 mV to 100 mV. The device operates on a single 3.3 V power supply, drawing 215 mA, within a temperature range of -40°C to +85°C. It accepts CML, LVDS, or LVPECL inputs and provides LVDS outputs. Packaged in a TQFP-48 format, it features a propagation delay of 2 ns.

Feature Summary

• Four independent channels for simultaneous signal buffering and repeating
• Supports multiple input standards including CML, LVDS, and LVPECL
• Integrated transmit pre-emphasis capability for signal integrity enhancement

Applications

• High-speed digital video distribution systems
• Point-to-point interconnects requiring signal regeneration
• Backplane communication interfaces

Procurement Notes

Verify the manufacturer origin carefully, as Texas Instruments acquired National Semiconductor's logic and interface portfolio. Confirm that the specific suffix 'TVS' corresponds to the intended package variant and ensure RoHS compliance documentation matches current inventory standards before finalizing procurement orders.

Selection Notes

Select this component when four-channel LVDS transmission is required at speeds up to 2 Gb/s. Ensure the design accommodates the 3.3 V supply requirement and the thermal characteristics of the TQFP-48 package. Verify that the input source signals are compatible with the specified CML, LVDS, or LVPECL levels.

Part Context

This part belongs to the DS15BR400 series of LVDS interface integrated circuits. It serves as a high-performance solution for extending differential signaling distances in digital systems. The device maintains signal integrity across long traces by actively driving and conditioning the output waveforms.

Replacement Considerations

The DS15BR400TSQ/NOPB is a documented alternative offering identical electrical specifications but housed in a WQFN-32 package. Designers must evaluate footprint compatibility and thermal dissipation differences when considering this substitution.