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DS17485SN-5+ is listed in the Real Time Clock range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC RTC CLK/CALENDAR PAR 24SOIC. Review the specifications below when checking this part for your BOM.
The DS17485SN-5+ is a real-time clock (RTC) IC from the DS17x85 family, designed as a successor to the DS12885. It provides timekeeping for seconds through year with leap-year compensation through 2099. The device features a multiplexed byte-wide interface and includes 4096 bytes of battery-backed nonvolatile SRAM alongside 114 bytes of general-purpose RAM. It supports optional +3.0V or +5.0V operation, with VCC supply ranges of 2.7V–3.7V or 4.5V–5.5V respectively. Key functions include a time-of-day alarm, six maskable interrupts, a programmable square-wave output, and power-control circuitry for system wake-up.
Verify component authenticity and physical condition upon receipt. Confirm that the package marking matches the DS17485SN-5+ designation. Check for any signs of mechanical damage or moisture exposure prior to installation. Ensure compliance with relevant environmental regulations applicable to the specific manufacturing batch.
Select this part when 4KB of extended nonvolatile memory is required in addition to standard RTC registers. Verify that the system design accommodates the multiplexed address/data bus timing requirements. Ensure the external crystal load capacitance matches the selected configuration bit for accurate frequency operation.
This component belongs to the DS17x85 series, which serves as an enhanced replacement for the industry-standard DS12885. The 'SN' suffix indicates a surface-mount SOIC package variant within the broader DS17485 product line. It shares functional compatibility with other members of the family while offering increased storage capacity.
Direct substitutes include the DS17485S-5+ and DS17485E-3. Verify pinout compatibility and voltage range specifications before substitution. Note that package dimensions may differ between SOIC and DIP variants.
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