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DS1848E-050+ is listed in the Digital Potentiometers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC RES/MEM TEMP 50/10K 14-TSSOP. Review the specifications below when checking this part for your BOM.
The DS1848E-050+ is a dual temperature-controlled nonvolatile variable resistor IC from Analog Devices/Maxim Integrated. It integrates one 50kΩ and one 10kΩ linear taper, 256-position digitally controlled resistor alongside a direct-to-digital temperature sensor. Resistor settings are determined by a temperature-addressed look-up table that assigns unique values for every 2°C increment across the -40°C to +95°C operating range. The device operates on a 3V to 5.5V supply and communicates via a standard 2-wire serial interface (SDA/SCL). It includes 128 bytes of user EEPROM and stores settings in nonvolatile memory.
Verify the specific suffix 'E' indicates the extended temperature grade (-40°C to +95°C) and '+' denotes lead-free compliance per the manufacturer's ordering information. Confirm package type is 14-pin TSSOP. Check current availability status as this component may be subject to lifecycle changes or limited distribution.
Select the DS1848E-050+ when a mixed resistance configuration (50kΩ and 10kΩ) is required within a single package. Ensure the application supports the 2-wire serial protocol for accessing temperature data and updating look-up tables. Verify that the programming temperature range (0°C to +70°C) aligns with system capabilities during configuration phases.
This part belongs to the DS1848 family of dual temperature-controlled NV variable resistors. The '050' designation specifically differentiates it from the DS1848-010, which contains two 10kΩ resistors. Both variants share the same pinout, interface, and core functionality but differ in the resistance value of the first channel.
The DS1848B-050 is available in a 16-ball CSBGA package with identical electrical specifications. Direct pin-compatible replacements are not listed; redesigning for the BGA package would be necessary if switching form factors.
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