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DS2760BE+025/T&R is listed in the Battery Management range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC BATT MONITOR LI-ION 16TSSOP. Review the specifications below when checking this part for your BOM.
The DS2760BE+025/T&R is a battery monitor IC designed for lithium-ion cells, manufactured by Analog Devices Inc./Maxim Integrated. It utilizes a single-wire interface for communication and data storage. The device operates within a temperature range of -20°C to +70°C (TA). It is housed in a 16-TSSOP package with a width of 4.40mm. The component provides fault protection against overcurrent, overvoltage, undervoltage, and short circuits. It is supplied in tape and reel packaging.
Verify the exact part number suffix and manufacturer documentation before procurement. Confirm that the component meets specific environmental standards such as RoHS compliance if required for your application. Check current availability status as this product may be discontinued or have limited supply. Ensure compatibility with existing system interfaces and voltage levels.
Select this component for applications requiring precise monitoring of single-cell lithium-ion batteries. Consider the operating temperature range and package size constraints. Evaluate the need for integrated fault protection features. Verify interface compatibility with the host microcontroller or processor. Review datasheet specifications for electrical characteristics and timing requirements.
This component belongs to the DS276x series of battery monitors from Maxim Integrated, now part of Analog Devices. These devices are designed for high-precision monitoring of lithium-based battery cells. The series typically includes features for state-of-charge indication and cell protection. The DS2760 variant focuses on essential monitoring and protection functions.
Check official manufacturer documentation for confirmed substitute part numbers. Verify pinout compatibility and electrical parameter equivalence. Ensure the replacement supports the same single-wire interface protocol. Confirm package dimensions match the existing PCB footprint.
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