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DS3170 is listed in the Telecom range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC TELECOM INTERFACE 100CSBGA. Review the specifications below when checking this part for your BOM.
The DS3170 is a single-chip transceiver designed for DS3 and E3 physical copper line interfacing. It integrates a DS3/E3 framer with a Line Interface Unit (LIU) to perform receive clock/data recovery and transmit waveshaping. The device supports 75Ω coaxial cable connections up to 380 meters for DS3 or 440 meters for E3, utilizing 1:2 transformers on both transmit and receive paths. It features an integrated Clock Rate Adapter (CLAD), HDLC controller with a 256-byte FIFO, and an on-chip Bit Error-Rate Tester (BERT). Power consumption is rated at 0.5W during 3.3V operation with 5V tolerant I/O. The component is available in a 100-pin CSBGA package measuring 11mm x 11mm.
Verify the specific ordering suffix when sourcing this component, as it dictates the operational temperature range and lead compliance status. The standard DS3170 variant operates from 0°C to +70°C, while the DS3170N variant extends the range to -40°C to +85°C. Suffixes ending in '+' indicate packages that are lead-free and RoHS compliant. Confirm the exact revision against the manufacturer's errata documentation before finalizing procurement specifications.
Select the appropriate temperature grade based on the intended deployment environment; industrial applications typically require the -40°C to +85°C rating found in the 'N' suffix variants. Ensure the system design accommodates the 100-pin CSBGA footprint, which measures 11mm by 11mm. Verify that the host processor interface requirements align with the supported 8-bit, 16-bit parallel, or slave SPI serial bus options provided by the device architecture.
This component belongs to the DS317X product family, which includes dual, triple, and quad channel versions of the DS3/E3 transceiver. The DS3170 serves as the single-channel entry point within this series. It maintains software compatibility with the broader DS3171 through DS3174 SCT product family, allowing for scalable designs across different port density requirements without significant firmware modifications.
Publicly confirmed substitute part numbers are not available in the verified source material.
The device supports B3ZS encoding for DS3 lines and HDB3 encoding for E3 lines via its integrated line encoder/decoder block.
The CLAD generates the internally required 44.736MHz clock for DS3 or 34.368MHz clock for E3 from a single external clock reference source.
The on-chip framer supports DS3 M23 and C-Bit standards, as well as E3 G.751 and G.832 standards.
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